SIST EN 61189-3:2008

SLOVENSKI STANDARD
SIST EN 61189-3:2008
01-junij-2008
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SIST EN 61189-3:2001
SIST EN 61189-3:2001/A1:2001
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Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:2008
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-3:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-3:2008

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SIST EN 61189-3:2008


EUROPEAN STANDARD
EN 61189-3

NORME EUROPÉENNE
January 2008
EUROPÄISCHE NORM

ICS 31.180 Supersedes EN 61189-3:1997 + A1:1999


English version


Test methods for electrical materials, printed boards
and other interconnection structures and assemblies -
Part 3: Test methods for interconnection structures (printed boards)
(IEC 61189-3:2007)


Méthodes d'essai pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées Leiterplatten und andere Verbindungs-
et autres structures d'interconnexion strukturen und Baugruppen -
et ensembles - Teil 3: Prüfverfahren für Verbindungs-
Partie 3: Méthodes d'essai des structures strukturen (Leiterplatten)
d'interconnexion (cartes imprimées) (IEC 61189-3:2007)
(CEI 61189-3:2007)




This European Standard was approved by CENELEC on 2007-12-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-3:2008 E

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SIST EN 61189-3:2008
EN 61189-3:2008 – 2 –
Foreword
The text of document 91/698/FDIS, future edition 2 of IEC 61189-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-3 on 2007-12-01.
This European Standard supersedes EN 61189-3:1997 + A1:1999.
The major technical changes with regard to EN 61189-3:1997 + A1:1999 concern the addition of 25 new
tests, as follows:
– 6 V: Visual test methods: 3V01, 3V02 and 3V03;
– 7 D: Dimensional test methods: 3D03;
– 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
– 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
– 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
– 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
– 12 X: Miscellaneous test methods: 3X01.
EN 61189-3:2007 also includes the deletion of Annex B: Conversion table, as the referred documents
have been withdrawn. Should anyone wish to consult such information, they should refer to
EN 61189-3:1997.
The new general title of EN 61189 series is Test methods for electrical materials, printed boards and
other interconnection structures and assemblies. Titles of existing standards in this series will be updated
at the time of revision.
This standard should be used in conjunction with the following parts:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in manufacturing electronic assemblies
It should also be read in conjunction with the series EN 60068, Environmental testing.
The following dates were fixed:

– latest date by which the EN has to be implemented

at national level by publication of an identical
(dop) 2008-09-01
national standard or by endorsement

– latest date by which the national standards conflicting
(dow) 2010-12-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 61189-3:2008
– 3 – EN 61189-3:2008
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60051 Series Direct acting indicating analogue electrical EN 60051 Series
measuring instruments and their accessories


1)
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
Part 1: General and guidance


IEC 60068-2-20 1979 Environmental testing -

+ A2 1987 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988


2) 3)
IEC 60068-2-78 – Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state


2)
IEC 60169-15 – Radio-frequency connectors - – –
Part 15: R.F. coaxial connectors with inner
diameter of outer conductor 4,13 mm
(0,163 in) with screw coupling - Characteristic
impedance 50 ohms (Type SMA)


IEC 60454-1 1992 Specifications for pressure-sensitive EN 60454-1 1994
adhesive tapes for electrical purposes -
Part 1: General requirements


IEC 60454-3-1 1998 Pressure-sensitive adhesive tapes for EN 60454-3-1 1998
electrical purposes -
Part 3-1: Specifications for individual
materials - PVC film tapes with
pressure-sensitive adhesive


2) 3)
IEC 60584-1 – Thermocouples - EN 60584-1 1995
Part 1: Reference tables


2) 3)
IEC 60695-11-5 – Fire hazard testing - EN 60695-11-5 2005
Part 11-5: Test flames - Needle-flame test
method - Apparatus, confirmatory test
arrangement and guidance



1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated reference.
3)
Valid edition at date of issue.

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SIST EN 61189-3:2008
EN 61189-3:2008 – 4 –
Publication Year Title EN/HD Year
IEC 61188-1-2 1998 Printed boards and printed board EN 61188-1-2 1998
assemblies - Design and use -
Part 1-2: Generic requirements - Controlled
impedance


IEC 61189-1 1997 Test methods for electrical materials, EN 61189-1 1997
interconnection structures and assemblies -
Part 1: General test methods and
methodology


2) 3)
IEC 61190-1-1 – Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high quality interconnections in electronics
assembly


2) 3)
IEC 61190-1-2 – Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering paste for
high quality interconnects in electronics
assembly


IEC 62326-4 1996 Printed boards - EN 62326-4 1997
Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional
specification


IEC 62326-4-1 1996 Printed boards - EN 62326-4-1 1997
Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional
specification -
Section 1: Capability Detail Specification -
Performance levels A, B and C


4)
ISO 4046 1978 Paper, board, pulp and related terms - – –
Vocabulary


5) 5)
ISO 9002 1994 Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing


ISO 9453 2006 Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms



4)
ISO 4046 has been withdrawn and replaced by ISO 4046, Parts 1 to 5.
5)
Withdrawn.

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SIST EN 61189-3:2008
IEC 61189-3
Edition 2.0 2007-10
INTERNATIONAL
STANDARD

Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XE
ICS 31.180 ISBN 2-8318-9324-0

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SIST EN 61189-3:2008
– 2 – 61189-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object .7
2 Normative references.7
3 Accuracy, precision and resolution .8
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods .11
6 V: Visual test methods .11
7 D: Dimensional test methods .14
8 C: Chemical test methods .17
9 M: Mechanical test methods.30
10 E: Electrical test methods .48
11 N: Environmental test methods .75
12 X: Miscellaneous test methods.93

Annex A (informative) Worked examples. 117

Figure 1 – Glow wire .19
Figure 2 – Test apparatus .20
Figure 3a – Horizontal specimen – Flame applied to surface.24
Figure 3b – Horizontal specimen – Flame applied to edge .24
Figure 3c – Vertical specimen – Lower edge horizontal – Flame applied to edge .25
Figure 3d – Vertical specimen – Lower edge horizontal – Flame applied to surface .25
Figure 3e – Needle burner test – Side views of test board and burner .26
Figure 3 – Needle burner test .26
Figure 4 – Flux type classification by copper mirror test .30
Figure 5 – Copper foil for peel test .33
Figure 5a – Hold down clamping system.32
Figure 5b – Single load mode .32
Figure 5c – Multiple load mode.32
Figure 5d – Keyhole hold down fixture .33
Figure 6 – Bow.36
Figure 7 – Twist .36
Figure 8 – Test set-up for bow measurement.37
Figure 9 – Specimen set-up for twist measurement.37
Figure 10a – Specimen set-up for referee test for twist, raised parallel surfaces .39
Figure 10b – Specimen setup for referee test for twist, supporting jacks or blocks .39
Figure 10c – Specimen setup for referee test for twist measurements.39
Figure 10 – Specimen setup for referee test .39
Figure 11 – Bow measurement .40

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SIST EN 61189-3:2008
61189-3 © IEC:2007(E) – 3 –
Figure 12 – Twist measurement .40
Figure 13 – Measuring equipment for peel strength of flexible printed boards.43
Figure 14 – Pencil holder.46
Figure 15a – Location of test specimens.54
Figure 15b – Location of test specimens.55
Figure 15 – Composite test pattern.55
Figure 16 – Test specimen artwork.61
Figure 17 – Fluidized sand bath.64
Figure 18 – Possible equipment configuration.68
Figure 19 – Schematic showing undisturbed interval.68
Figure 20 – Test wave form example .70
Figure 21 – Incident wave voltage showing (2 X) air line delay .70
Figure 22 – Details of test specimen.72
Figure 23 – Circuit diagram for measurement of contact resistance .73
Figure 24 – Keypad contact patterns .75
Figure 25 – Plier fixture for thermal shock test, dip soldering .82
Figure 26 – Temperature cycles for moisture and insulation resistance test graph.92
Figure 27 – Insulation resistance coupon (μm).92
Figure 28 – Typical ‘‘comb pattern’’ .93
Figure 29 – Suggested test specimen for surface mount features . 104
Figure 30 – Suggested test specimen for plated through holes. 104
Figure 31 – Rotary dip solderability test equipment . 107
Figure 32 – Effectiveness of solder wetting of plated through holes. 110
Figure 33 – Test specimen . 116

Table 1 – Student’s "t" distribution.10
Table 2 – Preferred land, hole and wire dimensions.44
Table 3 – Resistance values.61
Table 4 – Chamber temperatures for one cycle.86
Table 5 – Accelerated ageing and test requirements. 105
Table 6 – Maximum limits of solder bath contaminants . 106

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SIST EN 61189-3:2008
– 4 – 61189-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3: Test methods for interconnection structures
(printed boards)


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 1997, its amendment 1
(1999) and constitutes a technical revision.
The document 91/698/FDIS, circulated to the National Committees as Amendment 2, led to the
publication of the new edition.
The major technical changes with regard to the previous edition concern the addition of 25 new
tests, as follows:
− 6 V: Visual test methods: 3V01, 3V02 and 3V03;
− 7 D: Dimensional test methods: 3D03;

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SIST EN 61189-3:2008
61189-3 © IEC:2007(E) – 5 –
− 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
− 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
− 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
− 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
− 12 X: Miscellaneous test methods: 3X01
This edition also includes the deletion of Annex B: Conversion table, as the referred documents
were disbanded in 2005 and do not officially exist. Should any one wish to consult such
information, they should refer to the first edition of IEC 61189-3 (1997).
The text of this standard is based on the first edition, its Amendment 1 and the following
documents:
FDIS Report on voting
91/698/FDIS 91/727/RVD

Full information on the voting for the approval of this amendment can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 61189 series, under the general title Test methods for electrical
materials, printed boards and other interconnection structures and assemblies, can be found
on the IEC website.
NOTE Future standards in this series will carry the new general title as cited above. Titles of existing standards in
this series will be updated at the time of the next edition.
This standard should be used in conjunction with the following parts:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for electronic components assembling characteristics
Part 5: Test methods printed board assemblies and also the following standard
Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 60068 (all parts), Environmental testing
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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SIST EN 61189-3:2008
– 6 – 61189-3 © IEC:2007(E)
INTRODUCTION
IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as
related materials or component robustness, irrespective of their method of manufacture.
The standard is divided into separate parts, covering information for the designer and the test
methodology engineer or technician. Each part has a specific focus; methods are grouped
according to their application and numbered sequentially as they are developed and released.
In some instances test methods developed by other TCs (e.g. TC 50) have been reproduced
from existing IEC standards in order to provide the reader with a comprehensive set of test
methods. When this situation occurs, it will be noted on the specific test method; if the test
method is reproduced with minor revision, those paragraphs that are different are identified.
This part of IEC 61189 contains test methods for evaluating printed boards and other forms of
interconnection structures. The methods are self-contained, with sufficient detail and
description so as to achieve uniformity and reproducibility in the procedures and test
methodologies.
The tests shown in this standard are grouped according to the following principles:
P: preparation/conditioning methods
V: visual test methods
D: dimensional test methods
C: chemical test methods
M: mechanical test methods
E: electrical test methods
N: environmental test methods
X: miscellaneous test methods
To facilitate reference to the tests, to retain consistency of presentation, and to provide for
future expansion, each test is identified by a number (assigned sequentially) added to the
prefix (group code) letter showing the group to which the test method belongs.
The test method numbers have no significance with respect to an eventual test sequence; that
responsibility rests with the relevant specification that calls for the method being performed.
The relevant specification, in most instances, also describes pass/fail criteria.
The letter and number combinations are for reference purposes, to be used by the relevant
specification. Thus "3D02" represents the second dimensional test method described in this
publication.
In short, for this example, 3 is the part of IEC standard (61189-3), D is the group of methods,
and 02 is the test number.
A list of all test methods included in this standard, as well as those under consideration is given
in Annex B. This annex will be reissued whenever new tests are introduced.

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SIST EN 61189-3:2008
61189-3 © IEC:2007(E) – 7 –
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3: Test methods for interconnection structures
(printed boards)



1 Scope
This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for manufacturing interconnection
structures (printed boards) and assemblies.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60051 (all parts), Direct acting indicating analogue electrical measuring instruments and
their accessories
IEC 60068-1: 1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20: 1979, Environmental testing – Part 2: Tests – Test T: Soldering
Amendment 2 (1987)
IEC 60068-2-78, Environmental testing – Part 2-78: Tests –Test Cab: Damp heat, steady state
IEC 60169–15, Radio-frequency connectors – Part 15: RF coaxial connectors with inner
diameter of outer conductor 4,13 mm (0,163 in) with screw coupling – Characteristic
impedance 50 ohms (Type SMA)
IEC 60454-1:1992, Specifications for pressure-sensitive adhesive tapes for electrical purposes
– Part 1: General requirements
IEC 60454-3-1:1998, Pressure-sensitive adhesive tapes for electrical purposes – Part 3:
Specifications for individual materials – Sheet 1: PVC film tapes with pressure-sensitive
adhesive
IEC 60584-1, Thermocouples – Part 1: reference tables
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle flame test method –
Apparatus, confirmatory test arrangement and guidance

IEC 61188-1-2:1998, Printed boards and printed board assemblies – Design and use –
Part 1-2: Generic requirements – Controlled impedance

IEC 61189-1:1997, Test methods for electrical materials, interconnection structures and
assemblies – Part 1: General test methods and methodology
IEC 61190-1-1, Attachment materials for ele
...