SIST EN 61709:2011

SLOVENSKI STANDARD
SIST EN 61709:2011
01-oktober-2011
(OHNWULþQHNRPSRQHQWH=DQHVOMLYRVW5HIHUHQþQLSRJRML]DSRJRVWRVWRGSRYHGLLQ
PRGHOHREUHPHQMHYDQMD]DSUHWYDUMDQMH
Electric components - Reliability - Reference conditions for failure rates and stress
models for conversion
Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance
et modèles de contraintes pour la conversion
Ta slovenski standard je istoveten z: EN 61709:2011
ICS:
21.020 =QDþLOQRVWLLQQDþUWRYDQMH Characteristics and design of
VWURMHYDSDUDWRYRSUHPH machines, apparatus,
equipment
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 61709:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61709:2011

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SIST EN 61709:2011

EUROPEAN STANDARD
EN 61709

NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM

ICS 31.020 Supersedes EN 61709:1998


English version


Electric components -
Reliability -
Reference conditions for failure rates and stress models for conversion
(IEC 61709:2011)


Composants électriques -  Elektrische Bauelemente -
Fiabilité - Zuverlässigkeit -
Conditions de référence pour les taux de Referenzbedingungen für Ausfallraten und
défaillance et modèles de contraintes pour Beanspruchungsmodelle zur Umrechnung
la conversion (IEC 61709:2011)
(CEI 61709:2011)





This European Standard was approved by CENELEC on 2011-07-29. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61709:2011 E

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SIST EN 61709:2011
EN 61709:2011 - 2 -
Foreword
The text of document 56/1422/FDIS, future edition 2 of IEC 61709, prepared by IEC TC 56,
Dependability, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 61709 on 2011-07-29.
This European Standard supersedes EN 61709:1998.
EN 61709:2011 includes the following significant technical changes with respect to EN 61709:1998:
– the addition of a number of component types and the updating of models for a large number of
component types;
– the addition of annexes on reliability prediction, sources of failure rate data and component
classification information.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-04-29
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-07-29
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61709:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60300-3-2:2004 NOTE  Harmonized as EN 60300-3-2:2005 (not modified).
IEC 60721 series NOTE  Harmonized in EN 60721 series.
IEC 61360 series NOTE  Harmonized in EN 61360 series.
IEC 61360-1:2009 NOTE  Harmonized as EN 61360-1:2010 (not modified).
IEC 61360-4:2005 NOTE  Harmonized as EN 61360-4:2005 (not modified).
IEC 61649:2008 NOTE  Harmonized as EN 61649:2008 (not modified).
IEC 61703 NOTE  Harmonized as EN 61703.
IEC 62308 NOTE  Harmonized as EN 62308.
ISO 10303-11:1994 NOTE  Harmonized as EN ISO 10303-11:1995 (not modified).
ISO 10303-31 NOTE  Harmonized as EN ISO 10303-31.
__________

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SIST EN 61709:2011
- 3 - EN 61709:2011
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60050-191 - International Electrotechnical Vocabulary - -
(IEV) -
Chapter 191: Dependability and quality of
service


IEC 60605-6 - Equipment reliability testing - - -
Part 6: Tests for the validity and estimation of
the constant failure rate and constant failure
intensity


IEC 60721-3-3 - Classification of environmental conditions - EN 60721-3-3 -
Part 3: Classification of groups of
environmental parameters and
their severities -
Section 3: Stationary use at weatherprotected
locations


IEC 60721-3-4 - Classification of environmental conditions - EN 60721-3-4 -
Part 3: Classification of groups of
environmental parameters and
their severities -
Section 4: Stationary use at non-
weatherprotected locations


IEC 60721-3-5 - Classification of environmental conditions - EN 60721-3-5 -
Part 3: Classification of groups of
environmental parameters and
their severities -
Section 5: Ground vehicle installations


IEC 60721-3-7 - Classification of environmental conditions - EN 60721-3-7 -
Part 3: Classification of groups of
environmental parameters and
their severities -
Section 7: Portable and non-stationary use

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SIST EN 61709:2011

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SIST EN 61709:2011
IEC 61709
®

Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Electric components – Reliability – Reference conditions for failure rates and
stress models for conversion

Composants électriques – Fiabilité – Conditions de référence pour les taux
de défaillance et modèles de contraintes pour la conversion

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XD
ICS 31.020 ISBN 978-2-88912-551-7

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61709:2011
– 2 – 61709 © IEC:2011
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and symbols . 10
3.1 Terms and definitons . 10
3.2 Symbols . 12
4 Context and conditions . 13
4.1 Failure modes . 13
4.2 Operating profile considerations . 14
4.3 Storage conditions . 14
4.4 Environmental conditions . 14
5 Generic reference conditions and stress models . 16
5.1 Recommended generic reference conditions . 16
5.2 Generic stress models . 17
5.2.1 General . 17
5.2.2 Stress factor for voltage dependence, π . 18
U
5.2.3 Stress factor for current dependence, π . 18
I
5.2.4 Stress factor for temperature dependence, π . 18
T
5.2.5 Environmental application factor, π . 20
E
5.2.6 Other factors of influence . 21
6 Specific reference conditions and stress models. 21
6.1 Integrated semiconductor circuits . 21
6.1.1 Reference conditions . 21
6.1.2 Stress factors . 23
6.2 Discrete semiconductors . 27
6.2.1 Reference conditions . 27
6.2.2 Stress factors . 28
6.3 Optoelectronic components . 32
6.3.1 Reference conditions . 32
6.3.2 Stress factors . 34
6.4 Capacitors . 38
6.4.1 Reference conditions . 38
6.4.2 Stress factors . 38
6.5 Resistors and resistor networks . 41
6.5.1 Reference conditions . 41
6.5.2 Stress factors . 42
6.6 Inductors, transformers and coils . 43
6.6.1 Reference conditions . 43
6.6.2 Stress factors . 43
6.7 Microwave devices . 44
6.7.1 Reference conditions . 44
6.7.2 Stress factors . 45
6.8 Other passive components . 45
6.8.1 Reference conditions . 45

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SIST EN 61709:2011
61709 © IEC:2011 – 3 –
6.8.2 Stress factors . 45
6.9 Electrical connections. 45
6.9.1 Reference conditions . 45
6.9.2 Stress factors . 46
6.10 Connectors and sockets . 46
6.10.1 Reference conditions . 46
6.10.2 Stress factors . 46
6.11 Relays . 46
6.11.1 Reference conditions . 46
6.11.2 Stress factors . 47
6.12 Switches and push-buttons . 49
6.12.1 Reference conditions . 49
6.12.2 Stress factors . 50
6.13 Signal and pilot lamps . 51
6.13.1 Reference conditions . 51
6.13.2 Stress factors . 51
Annex A (normative) Failure modes of components . 53
Annex B (informative) Failure rate prediction . 55
Annex C (informative) Considerations for the design of a data base on failure rates . 65
Annex D (informative) Potential sources of failure rate data and methods of selection . 68
Annex E (informative) Overview of component classification . 74
Annex F (informative) Examples . 86
Bibliography . 88

Figure 1 – Selection of stress regions in accordance with current and voltage-operating
conditions . 48
Figure 2 – Selection of stress regions in accordance with current and voltage-operating
conditions . 50
Figure B.1 – Stress profile . 59
Figure B.2 – Averaging failure rates . 60

Table 1 – Basic environments . 15
Table 2 – Values of environmental parameters for basic environments . 15
Table 3 – Recommended reference conditions for environmental and mechanical
stresses . 17
Table 4 – Environmental application factor, π . 20
E
Table 5 – Memory . 21
Table 6 – Microprocessors and peripherals, microcontrollers and signal processors . 22
Table 8 – Analog integrated circuits (IC) . 23
Table 9 – Application-specific ICs (ASICs) . 23
Table 10 – Constants for voltage dependence . 24
Table 11– Factor π for digital CMOS-family ICs . 24
U
Table 12 – Factor π for bipolar analog ICs . 24
U
Table 13 – Constants for temperature dependence . 24

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SIST EN 61709:2011
– 4 – 61709 © IEC:2011
for ICs (without EPROM; FLASH-EPROM; OTPROM; EEPROM;
Table 14 – Factor π
T
EAROM) . 26
Table 15 – Factor π for EPROM, FLASH-EPROM, OTPROM, EEPROM, EAROM. 26
T
Table 16 – Transistors common, low frequency. 27
Table 17 – Transistors, microwave, e.g. RF >800 MHz. 27
Table 18 – Diodes . 28
Table 19 – Power semiconductors . 28
Table 20 − Constants for voltage dependence of transistors . 29
Table 21 – Factor π for transistors . 29
U
Table 22 – Constants for temperature dependence of discrete semiconductors . 29
Table 23 – Factor π for transistors, reference and microwave diodes . 31
T
Table 24 – Factor for diodes (without reference and microwave diodes) and power
π
T
semiconductors . 31
Table 25 – Optoelectronic semiconductor signal receivers . 32
Table 26 – LEDs, IREDs, laser diodes and transmitter components . 33
Table 27 – Optocouplers and light barriers. 33
Table 28 – Passive optical components . 34
Table 29 – Transceiver, transponder and optical sub-equipment . 34
Table 30 – Constants for voltage dependence of phototransistors . 35
Table 31 – Factor π for phototransistors . 35
U
Table 32 – Constants for current dependence of LEDs and IREDs . 35
Table 33 – Factor π for LEDs and IREDs . 35
I
Table 34 – Constants for temperature dependence of optoelectronic components . 36
Table 35 – Factor π for optical components . 37
T
Table 36 – Capacitors . 38
Table 37 – Constants for voltage dependence of capacitors . 39
Table 38 – Factor π for capacitors . 39
U
Table 39 – Constants for temperature dependence of capacitors . 40
Table 40 – Factor π for capacitors . 41
T
Table 41 – Resistors and resistor networks . 42
Table 42 – Constants for temperature dependence of resistors . 42
Table 43 – Factor π for resistors . 43
Τ
Table 44 – Inductors, transformers and coils . 43
Table 45 – Constants for temperature dependence of inductors, transformers and coils . 43
Table 46 – Factor π for inductors, transformers and coils . 44
Τ
Table 47 – Microwave devices . 44
Table 48 – Other passive components . 45
Table 49 – Electrical connections. 46
Table 50 – Connectors and sockets . 46
Table 51 – Relays . 47
Table 52 – Factor π for low current relays. 48
ES

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SIST EN 61709:2011
61709 © IEC:2011 – 5 –
Table 53 – Factor π for general purpose relays . 48
ES
Table 54 – Factor π for automotive relays . 49
ES
Table 55 – Constants for temperature dependence of relays . 49
Table 56 – Facteur π for relays . 49
T
Table 57 – Switches and push-buttons . 50
Table 58 – Factor π for switches and push-buttons for low electrical stress . 51
ES
Table 59 – Factor π for switches and push-buttons for higher electrical stress . 51
ES
Table 60 – Signal and pilot lamps . 51
Table 61 – Factor π for signal and pilot lamps . 52
U
Table A.1 – Failure modes – Integrated circuits (ICs)(digital) . 53
Table A.2 – Failure modes – Transistors, diodes, optocouplers . 53
Table A.3 – Failure modes – Capacitors . 54
Table A.4 – Failure modes – Resistors, inductive devices, relays . 54
Table C.1 – Reliability prediction database attributes . 66
Table D.1 – Sources of reliability data (in alphabetical order) . 70
Table E.1 – Classification tree (IEC 61360). 75

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SIST EN 61709:2011
– 6 – 61709 © IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

ELECTRIC COMPONENTS –
RELIABILITY –
REFERENCE CONDITIONS FOR FAILURE RATES
AND STRESS MODELS FOR CONVERSION


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61709 has been prepared by IEC technical committee 56:
Dependability.
This second edition cancels and replaces the first edition, published in 1996 and constitutes a
technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– the addition of a number of component types and the updating of models for a large
number of component types;
– the addition of annexes on reliability prediction, sources of failure rate data and
component classification information.

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SIST EN 61709:2011
61709 © IEC:2011 – 7 –
The text of this standard is based on the following documents:
FDIS Report on voting
56/1422/FDIS 56/1431/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication.
...