SIST EN 61189-5-4:2015

SLOVENSKI STANDARD
SIST EN 61189-5-4:2015
01-september-2015
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Test methods for electrical materials, interconnection structures and assemblies -- Part 5
-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed
solid wire
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 5-4: Allgemeine Prüfverfahren für Materialien und Baugruppen -
Lotlegierungen und Lotdraht mit und ohne Flussmittel für bestückte Leiterplatten
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 5-4: Méthodes d'essai générales pour
les matériaux et les assemblages - Alliages à braser et brasages solides fluxés et non
fluxés pour les assemblages de cartes imprimées
Ta slovenski standard je istoveten z: EN 61189-5-4:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-5-4:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-5-4:2015

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SIST EN 61189-5-4:2015


EUROPEAN STANDARD EN 61189-5-4

NORME EUROPÉENNE

EUROPÄISCHE NORM
March 2015
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-4: General
test methods for materials and assemblies - Solder alloys and
fluxed and non-fluxed solid wire for printed board assemblies
(IEC 61189-5-4:2015)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen -
ensembles - Partie 5-4: Méthodes d'essai générales pour Teil 5-4: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Alliages à braser et Baugruppen - Lotlegierungen und Lotdraht mit und ohne
brasages solides fluxés et non fluxés pour les assemblages Flussmittel für bestückte Leiterplatten
de cartes imprimées (IEC 61189-5-4:2015)
(IEC 61189-5-4:2015)
This European Standard was approved by CENELEC on 2015-02-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61189-5-4:2015 E

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SIST EN 61189-5-4:2015
EN 61189-5-4:2015 - 2 -
Foreword
The text of document 91/1212/FDIS, future edition 1 of IEC 61189-5-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-5-4:2015.

The following dates are fixed:
(dop) 2015-11-12
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-02-12
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61189-5-4:2015 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 61189-1 NOTE Harmonized as EN 61189-1.
IEC 61189-2:2006 NOTE Harmonized as EN 61189-2:2006 (not modified).
IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified).
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7.
IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001.
ISO 9455-2 NOTE Harmonized as EN ISO 9455-2.

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SIST EN 61189-5-4:2015
- 3 - EN 61189-5-4:2015
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year
IEC 61189-5 -  Test methods for electrical materials, EN 61189-5 -
interconnection structures
and assemblies -
Part 5: Test methods for printed board
assemblies
IEC 61189-6 -  Test methods for electrical materials, EN 61189-6 -
interconnection structures
and assemblies -
Part 6: Test methods for materials used in
manufacturing electronic assemblies
IEC 61190-1-3 -  Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications

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SIST EN 61189-5-4:2015

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SIST EN 61189-5-4:2015



IEC 61189-5-4

®


Edition 1.0 2015-01




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 5-4: General test methods for materials and assemblies – Solder alloys and


fluxed and non-fluxed solid wire for printed board assemblies



Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres


structures d'interconnexion et ensembles –

Partie 5-4: Méthodes d'essai générales pour les matériaux et les assemblages –

Alliages à braser et brasages solides fluxés et non fluxés pour les assemblages

de cartes imprimées









INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-1999-7



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61189-5-4:2015
– 2 – IEC 61189-5-4:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Accuracy, precision and resolution . 7
3.1 General . 7
3.2 Accuracy . 8
3.3 Precision . 8
3.4 Resolution . 9
3.5 Report. 9
3.6 Student’s t distribution . 9
3.7 Suggested uncertainty limits . 10
4 C: Chemical test methods . 11
4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated
and/or flux-cored solder . 11
4.1.1 Object . 11
4.1.2 Test specimen . 11
4.1.3 Apparatus . 11
4.1.4 Test procedure . 11
4.2 Test 5-4CXX . 12
5 X: Miscellaneous test methods . 12
5.1 Test 5-4X01: Spread test, extracted cored wires or preforms . 12
5.1.1 Object . 12
5.1.2 Method A . 12
5.1.3 Method B . 13
5.1.4 Additional information . 15
5.2 Test 5-4X02: Spitting test of flux-cored wire solder . 15
5.2.1 Object . 15
5.2.2 Method A . 15
5.2.3 Method B . 16
5.2.4 Additional information . 19
5.3 Test 5-4X03: Solder pool test . 20
5.3.1 Object . 20
5.3.2 Test specimen . 20
5.3.3 Apparatus and reagents . 20
5.3.4 Test procedure . 20
5.3.5 Evaluation . 21
5.3.6 Additional information . 21
Bibliography . 22

Figure 1 – Test apparatus for spitting test . 16
Figure 2 – Test apparatus for spitting test, method B . 18
Figure 3 – Collecting paper with printed concentric circles with 1 cm pitch . 19

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SIST EN 61189-5-4:2015
IEC 61189-5-4:2015 © IEC 2015 – 3 –
Table 1 – Student’s t distribution . 10
2
Table 2 – Typical spread areas defined in mm . 13
Table 3 – Example of a test report – Spitting of flux-cored wire . 19

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SIST EN 61189-5-4:2015
– 4 – IEC 61189-5-4:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –

Part 5-4: General test methods for materials and assemblies –
Solder alloys and fluxed and non-fluxed solid wire for
printed board assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-5-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1212/FDIS 91/1225/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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SIST EN 61189-5-4:2015
IEC 61189-5-4:2015 © IEC 2015 – 5 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This International Standard is used in conjunction with IEC 61189-1:1997, IEC 61189-2:2006,
IEC 61189-3:2007.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 61189-5-4:2015
– 6 – IEC 61189-5-4:2015 © IEC 2015
INTRODUCTION
IEC 61189 relates to test methods for materials or component robustness for printed board
assemblies, irrespective of their method of manufacture.
The standard is divided into separate parts, covering information for the designer and the test
methodology engineer or technician. Each part has a specific focus; methods are grouped
according to their application and numbered sequentially as they are developed and released.
In some instances test methods developed by other TCs (for example, TC 104) have been
reproduced from existing IEC standards in order to provide the reader with a comprehensive
set of test methods. When this situation occurs, it will be noted on the specific test method; if
the test method is reproduced with minor revision, those paragraphs that are different are
identified.
This part of IEC 61189 contains test methods for evaluating robustness of materials or
component for printed board assemblies. The methods are self-contained, with sufficient
detail and description so as to achieve uniformity and reproducibility in the procedures and
test methodologies.
The tests shown in this standard are grouped according to the following principles:
P: preparation/conditioning methods
V: visual test methods
D: dimensional test methods
C: chemical test methods
M: mechanical test methods
E: electrical test methods
N: environmental test methods
X: miscellaneous test methods
To facilitate reference to the tests, to retain consistency of presentation, and to provide for
future expansion, each test is identified by a number (assigned sequentially) added to the
prefix (group code) letter showing the group to which the test method belongs.
The test method numbers have no significance with respect to a possible test sequence; that
responsibility rests with the relevant specification that calls for the method being performed.
The relevant specification, in most instances, also describes pass/fail criteria.
The letter and number combinations are for reference purposes to be used by the relevant
specification. Thus "5-4C01" represents the first chemical test method described in
IEC 61189-5-4.
In short, in this example, 5-4 is the number of the part of IEC 61189, C is the group of
methods, and 01 is the test number.

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SIST EN 61189-5-4:2015
IEC 61189-5-4:2015 © IEC 2015 – 7 –
TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –

Part 5-4: General test methods for materials and assemblies –
Solder alloys and fluxed and non-fluxed solid wire for
printed board assemblies



1 Scope
This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid
wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for
solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61189-5, Test methods for electrical materials, interconnection structures and assemblies
– Part 5: Test methods for printed board assemblies
IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies
– Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
3 Accuracy, precision and resolution
3.1 General
Errors and uncertainties are inherent in all measurement processes. The information given
below enables valid estimates of the amount of error and uncertainty to be taken into account.
Test data serve a number of purposes which include
– monitoring of a process;
– enhancing of confidence in quality conformance;
– arbitration between customer and supplier.
In any of these circumstances, it is essential that confidence can be placed upon the test data
in terms of
– accuracy: calibration of the test instruments and/or system;
– precision: the repeatability and uncertainty of the measurement;

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SIST EN 61189-5-4:2015
– 8 – IEC 61189-5-4:2015 © IEC 2015
– resolution: the suitability of the test instrument and/or system.
3.2 Accuracy
The regime by which routine calibration of the test equipment is undertaken shall be clearly
stated in the quality documentation of the supplier or agency conducting the test and should
meet the requirements of ISO 9001.
The calibration shall be conducted by an agency having accreditation to a national or
international measurement standard institute. There should be an uninterrupted chain of
calibration to a national or international standard.
Where calibration to a national or international standard is not possible, round-robin
techniques may be used and documented to enhance confidence in measurement accuracy.
The calibration interval shall normally be one year. Equipment consistently found to be
outside acceptable limits of accuracy shall be subject to shortened calibration intervals.
Equipment consistently found to be well within acceptable limits may be subject to relaxed
calibration intervals.
A record of the calibration and maintenance history shall be maintained for each instrument.
These records should state the uncertainty of the calibration technique (in ± % deviation) in
order that uncertainties of measurement can be aggregated and determined.
A procedure shall be implemented to resolve any situation where an instrument is found to be
outside calibration limits.
3.3 Precision
The uncertainty budget of any measurement technique is made up of both systematic and
random uncertainties. All estimates shall be based upon a single confidence level, the
minimum being 95 %.
Systematic uncertainties are usually the predominant contributor and will include all
uncertainties not subject to random fluctuation. These include
– calibration uncertainties,
– errors due to the use of an instrument under conditions which differ from those under
which it was calibrated,
– errors in the graduation of a scale of an analogue meter (scale shape error).
Random uncertainties result from numerous sources but can be deduced from a repeated
measurement of a standard item. Therefore, it is not necessary to isolate the individual
contributions. These may include
– random fluctuations such as those due to the variation of an influence parameter.
Typically, changes in atmospheric conditions reduce the repeatability of a measurement,
– uncertainty in discrimination, such as setting a pointer to a fiducial mark or interpolating
between graduations on an analogue scale.
Aggregation of uncertainties: Geometric addition (root-sum-square) of uncertainties may be
used in most cases. Interpolation error is normally added separately and may be accepted as
being 20 % of the difference between the finest graduations of the scale of the instrument.

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SIST EN 61189-5-4:2015
IEC 61189-5-4:2015 © IEC 2015 – 9 –
2 2
U = ± (U + U ) + U
t s r i

where
U is the total uncertainty;
t
U is the systematic uncertainty;
s
U is the random uncertainty;
r
U is the interpolation error.
i
Determination of random uncertainties: Random uncertainty can be determined by repeated
measurement of a parameter and subsequent statistical manipulation of the measured data.
The technique assumes that the data exhibits a normal (Gaussian) distribution.
t ×σ
U =
r
n
where
U is the random uncertainty;
r
n is the sample size;
t is the percentage point of the t distribution as shown in Table 1;
σ is the standard deviation (σ ).
n–1
3.4 Resolution
It is paramount that the test equipment used is capable of sufficient resolution. Measurement
systems used should be capable of resolving 10 % (or better) of the test limit tolerance.
It is accepted that some technologies will place a physical limitation upon resolution (for
example, optical resolution).
3.5 Report
In addition to requirements detailed in the test specification, the report shall detail:
a) the test method used;
b) the identity of the sample(s);
c) the test instrumentation;
d) the specified limit(s);
e) an estimate of measurement uncertainty and resultant working limit(s) for the test;
f) the detailed test results;
g) the test date and operators’ signature.
3.6 Student’s t distribution
Table 1 gives values of the factor t for 95 % and 99 % confidence levels, as a function of the
number of measurements.

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SIST EN 61189-5-4:2015
– 10 – IEC 61189-5-4:2015 © IEC 2015
Table 1 – Student’s t distribution
Sample t value t value Sample t value t value
size 95 % 99 % size 95 % 99 %
2 12,7 63,7 14 2,16 3,01
3 4,3 9,92 15 2,14 2,98
4 3,18 5,84 16 2,13 2,95
5 2,78 4,6 17 2,12 2,92
6 2,57 4,03 18 2,11 2,9
7 2,45 3,71 19 2,1 2,88
8 2,36 3,5 20 2,09 2,86
9 2,31 3,36 21 2,08 2,83
10 2,26 3,25 22 2,075 2,82
11 2,23 3,17 23 2,07 2,81
12 2,2 3,11 24 2,065 2,8
13 2,18 3,05 25 2,06 2,79

3.7 Suggested uncertainty limits
The following target uncertainties are suggested:
a) Voltage <1 kV: ±1,5 %
b) Voltage >1 kV: ±2,5 %
c) Current <20 A: ±1,5 %
d) Current >20 A: ±2,5 %
Resistance
e) Earth and continuity: ±10 %
f) Insulation: ±10 %
g) Frequency: ±0,2 %
Time
h) Interval <60 s: ±1 s
i) Interval >60 s: ±2 %
j) Mass <10 g: ±0,5 %
k) Mass 10 g to 100 g: ±1 %
l) Mass >100 g: ±2 %
m) Force: ±2 %
n) Dimension <25 mm: ±0,5 %
o) Dimension >25 mm: ±0,1 mm
p) Temperature <100 °C: ±1,5 %
q) Temperature >100 °C: ±3,5 %
r) Humidity (30 to 75) % RH: ±5 % RH
Plating thicknesses
s) Backscatter method: ±10 %

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SIST EN 61189-5-4:2015
IEC 61189-5-4:2015 © IEC 2015 – 11 –
t) Microsection: ±2 μm
u) Ionic contamination: ±10 %
4 C: Chemical test methods
4.1 Test 5-4C01: Determination of the percent
...