SIST EN 61967-6:2005

SLOVENSKI SIST EN 61967-6:2005

STANDARD
december 2005
Integrirana vezja – Meritve elektromagnetnega sevanja, od 150 kHz do 1 GHz –
6. del: Meritve prevajanega sevanja – Metoda z magnetno sondo (IEC 61967-
6:2002)
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz
– Part 6: Measurement of conducted emissions – Magnetic probe method (IEC
61967-6:2002)
ICS 31.200 Referenčna številka
SIST EN 61967-6:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61967-6
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2002

ICS 31.200


English version


Integrated circuits -
Measurement of electromagnetic emissions,
150 kHz to 1 GHz
Part 6: Measurement of conducted emissions -
Magnetic probe method
(IEC 61967-6:2002)


Circuits intégrés -  Integrierte Schaltungen -
Mesure des émissions Messung von elektromagnetischen
électromagnétiques, 150 kHz à 1 GHz Aussendungen im Frequenzbereich
Partie 6: Mesure des émissions von 150 kHz bis 1 GHz
conduites - Teil 6: Messung der leitungsgeführten
Méthode de la sonde magnétique Aussendungen -
(CEI 61967-6:2002) Magnetsondenverfahren
(IEC 61967-6:2002)



This European Standard was approved by CENELEC on 2002-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61967-6:2002 E

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EN 61967-6:2002 - 2 -
Foreword
The text of document 47A/645/FDIS, future edition 1 of IEC 61967-6, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 61967-6 on 2002-09-01.

This European Standard should be read in conjunction with EN 61967-1:2002.

The following dates were fixed:

– latest date by which the EN has to be implemented
 at national level by publication of an identical
 national standard or by endorsement (dop) 2003-06-01

– latest date by which the national standards conflicting
 with the EN have to be withdrawn (dow) 2005-09-01

Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annexes A and ZA are normative and annexes B, C and D are informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61967-6:2002 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 61967-6:2002
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 61967-1 - Integrated circuits - Measurement of EN 61967-1 2002
electromagnetic emissions, 150 kHz to
1 GHz
Part 1: General conditions and
definitions

1) 2)
IEC 61967-4 - Part 4: Measurement of conducted EN 61967-4 2002
emissions - 1 ohm/150 ohm direct
coupling method



1)
Undated reference.
2)
Valid edition at date of issue.

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NORME CEI
INTERNATIONALE IEC
61967-6
INTERNATIONAL
Première édition
STANDARD
First edition
2002-06
Circuits intégrés –
Mesure des émissions électromagnétiques,
150 kHz à 1 GHz –
Partie 6:
Mesure des émissions conduites –
Méthode de la sonde magnétique
Integrated circuits –
Measurement of electromagnetic emissions,
150 kHz to 1 GHz –
Part 6:
Measurement of conducted emissions –
Magnetic probe method
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
CODE PRIX
PRICE CODE U
Commission Electrotechnique Internationale
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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61967-6 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.11
2 Normative references .11
3 Definitions .11
4 General .11
4.1 Measurement philosophy.11
4.2 Measurement principle .13
5 Test conditions .13
5.1 General .13
5.2 Frequency range .13
6 Test equipment.13
6.1 General .13
6.2 Magnetic probe .13
6.3 Probe spacing fixture and placement.13
7 Test set-up .19
7.1 General .19
7.2 Probe calibration .19
7.3 Modifications to standardized IC test board .19
7.3.1 Layer arrangement .19
7.3.2 Layer thickness .19
7.3.3 Decoupling capacitors .19
7.3.4 I/O pin loading .21
8 Test procedure .29
8.1 General .29
8.2 Test technique.29
9 Test report.29
9.1 General .29
9.2 Documentation .29
Annex A (normative) Probe calibration procedure – Microstrip line method .33
Annex B (informative) Measurement principle and calibration factor.39
Annex C (informative) Spatial resolution of magnetic probe .47
Annex D (informative) Angle pattern of probe placement.49
Bibliography.51
Figure 1 – Magnetic probe .15
Figure 2 – Magnetic probe 1st and 3rd layers .15
Figure 3 – Magnetic probe 2nd layer.17
Figure 4 – Magnetic probe – layer construction.17
Figure 5 – Standardized IC test board (sectional view 1).21
Figure 6 – Standardized IC test board (sectional view 2 – measurement line) .21

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61967-6 © IEC:2002 – 5 –
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer .23
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer .25
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer .25
Figure 10 – Measurement set-up .27
Figure 11 – Measurement circuit schematic .27
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board. .31
Figure A.1 – Cross-sectional view of a microstrip line for calibration .33
Figure A.2 – Measurement set-up for probe calibration .37
Figure B.1 – Cross-sectional view of a microstrip line .39
Figure B.2 – Measurement of magnetic probe output .43
Figure B.3 – Example of calibration factor for the magnetic probe
specified in figures 1, 2, 3, and 4 .45
Figure C.1 – Diagram for measuring a magnetic field distribution.47
Figure C.2 – Magnetic field distribution across the microstrip line (800 MHz) .47
Figure D.1 – Diagram for measuring an angle pattern of probe placement .49
Figure D.2 – Probe output to angle ϕ .49

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61967-6 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-6 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/645/FDIS 47A/653/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annex A forms an integral part of this standard.
Annexes B, C and D are for information only.
This standard should be read in conjunction with IEC 61967-1.

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61967-6 © IEC:2002 – 9 –
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
1
Part 2: Measurement of radiated emissions – TEM-cell method
1
Part 3: Measurement of radiated emissions – Surface scan method (technical specification)
2
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
2
Part 5: Measurement of conducted emissions – Workbench Faraday cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of this publication will remain unchanged until 2008.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
___________
1
 Under consideration.
2
 To be published.

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61967-6 © IEC:2002 – 11 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
1 Scope
This part of the IEC 61967 specifies a method for evaluating RF currents on the pins of an
integrated circuit (IC) by means of non-contact current measurement using a miniature
magnetic probe. This method is capable of measuring the RF currents generated by the IC
over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the
measurement of a single IC or a chip set of ICs on the standardized test board for
characterization and comparison purposes. It is also usable to evaluate the electromagnetic
characteristics of an IC or group of ICs on an actual application PCB for emission reduction
purposes. This method is called the "magnetic probe method".
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
3
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
3 Definitions
For the purposes of this part of IEC 61967 the definitions found in IEC 61967-1 apply.
4 General
4.1 Measurement philosophy
The emissions radiated from a PCB are, in part, caused by RF current generated by the
onboard IC which drives PCB traces, PCB ground and supply planes, and cables connected to
the PCB. All of these can act as RF antennas to radiate the emissions. The emission level is
proportional to the driving RF current, and is also affected significantly by PCB design,
radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from the
IC to the pseudo-antennas.
For this emission mechanism, the driving force of the IC can be a significant parameter for
both users and manufacturers to estimate and predict the electromagnetic characteristics of a
PCB, module, or system. A measure of the emission driving force can be obtained by
measuring the RF currents generated by the IC under test. Thus, the measured RF noise
current can be regarded as an indicator of the undesirable electromagnetic emission driving
force generated by the IC.
___________
3
To be published.

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61967-6 © IEC:2002 – 13 –
4.2 Measurement principle
Using this test method, the RF current on the power supply pins and I/O pins of an IC under
test can be measured using a miniature triplate-structured magnetic probe. This probe
measures the magnetic field at a specified height over a power supply or I/O strip conductor
on the standardized test board in a controlled manner. The RF current is calculated from the
measured magnetic field using the formula described in 8.2. With accurate mechanical
placement of the magnetic probe, this method provides a high degree of repeatability. In
addition, the frequency range of this method can be extended subject to the limitations
described in 5.2. Higher frequencies can be obtained without a substantial influence on
accuracy. The estimation of the RF current over the power supply or I/O strip conductor is an
easy and handy way of characterizing and comparing the ICs.
5 Test conditions
5.1 General
General test conditions are described in IEC 61967-1.
5.2 Frequency range
The effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. The
maximum frequency can be extended, if desired, subject to the limitations of the test set-up.
The upper limit of the frequency range is directly related to high frequency characteristics of
the magnetic probe and its distance from the line under test as described in annex B. At a low
frequency region of 0,15 MHz to 10 MHz, however, it may be advisable to use a low noise
pre-amplifier to improve dynamic range of the measurement.
6 Test equipment
6.1 General
For general information on test equipment see IEC 61967-1.
6.2 Magnetic probe
The magnetic probe shall be a triplate-structured strip line composed of a three-layer PCB.
Recommended probe construction details are shown in figures 1, 2, 3 and 4.
An SMA connector is attached at the edge of the PCB opposite to the rectangular loop portion
of the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1
and 3, which are connected to each other through four vias. The strip conductor pattern is on
layer 2, which is connected to the centre pin of the SMA connector.
6.3 Probe spacing fixture and placement
The probe output voltage depends on the distance between the probe tip and the strip
conductor under measurement. This makes it very critical to maintain a 1 mm space between
the strip conductor and the magnetic probe tip during this measurement. Therefore, a probe
spacing fixture shall be used to maintain 1,0 mm ± 0,1 mm spacing between the bottom of the
rectangular loop portion of the probe and strip line on the IC test board, or the entire probe
can be molded into a piece of fixing block which houses the probe so as to maintain the
specified space precisely as shown in figure 10.

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61967-6 © IEC:2002 – 15 –
In addition, the probe output voltage depends on probe placement angle (ϕ) to direction of
microstrip line under measurement. According to an experimental measurement on angle
patterns of probe directional placement, the angle shall be less than 15° for amplitude error to
be less than –2 dB. See annex D for details.
Via for SMA connector
through layers 1, 2, and 3
Via for SMA connector
through layers 1, 2, and 3
Pads for SMA connector
on layer 1 and 3
Signal line pattern on layer 2
30 mm
50 Ω strip line
Ground plane patterns
on layer 1 and layer 3
Rectangular loop portion
for detection
10 mm
Via through layers 1, 2, and 3
IEC  1468/02
Figure 1 – Magnetic probe
Via
Center line
Via
10 mm
30 mm 0,8 mm
1,8 mm 0,2 mm
Via: 0,25 mm diameter
8,4 mm
0,1 mm
10 mm
IEC  1469/02
Figure 2 – Magnetic probe – First and third layers

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61967-6 © IEC:2002 – 17 –
Via
Center line
30 mm
0,1 mm
1,0 mm
4,6 mm
Via: 0,25 mm diameter
0,4 mm
10 mm
IEC  1470/02
Figure 3 – Magnetic probe – Second layer
Layer 1
Insulator
Layer 2
Insulator
Layer 3
Insulators
(glass epoxy)
Insulators for reinforcement
(recommended)
Thickness of copper foils:
Layer 1: 0,035 mm
Layer 2: 0,035 mm
Layer 3: 0,035 mm
0,2 mm* 0,2 mm*
* Thickness of insulator
Center line
IEC  1471/02
Figure 4 – Magnetic probe – Layer construction

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61967-6 © IEC:2002 – 19 –
7 Test set-up
7.1 General
General test set-up requirements are described in IEC 61967-1.
The measurement set-up and circuit schematic of the magnetic probe measurement method
are shown in figures 10 and 11, respectively.
7.2 Probe calibration
The magnetic probe used shall be calibrated to obtain accurate correlation between the
measured magnetic field intensity and the estimated RF current. The probe calibration shall
be in accordance with the method described in annex A (microstrip line method).
7.3 Modifications to standardized IC test board
The standardized IC test board described in IEC 61967-1 shall be used. However, it shall be
adapted as shown in figures 5, 6, 7, 8, and 9.
7.3.1 Layer arrangement
The IC test board shall have a minimum of four layers. It is recommended to use a four-layer
IC test board as shown in figures 5 and 6. If necessary, additional layers may be inserted
between the top layer and the microstrip ground layer to accommodate additional signal
and/or power routing. The construction of the IC test board shall be as specified in
IEC 61967-1, except as noted below in the case of n layers in general.
1) Top layer (layer 1): The IC under test shall be put on layer 1. See IEC 61967-1.
2) Layer next to the bottom layer (layer n−1): A ground plane area shall be formed on layer
n−1 to provide a reference for the microstrip structures on the bottom layer. The ground
plane can cover the entire layer or can be limited to the area under the microstrip
structures as shown in the dotted line area of figures 7 and 8. This ground plane area shall
have a minimum width of 11 mm and a minimum length of 14 mm.
3) Bottom layer (layer n): The microstrip conductor lines for measurement and peripheral
ground planes shall be on layer n. The microstrip conductor lines shall be in accordance
with figures 7 and 8 for power lines and I/O lines, respectively. The width of the strip
conductor line shall be 1,0 mm at maximum to achieve a high spatial resolution. See
annex C for details. The length of the microstrip conductor lines should be between 14 mm
and 25 mm in length to avoid standing waves.
7.3.2 Layer thickness
The PCB insulator thickness of 0,6 mm between layer n−1 and layer n is strongly
recommended. The coplanar gap between the measurement line and coplanar ground planes
shall be at least 2,0 mm and shall be at least three times the insulator thickness.
7.3.3 Decoupling capacitors
Decoupling capacitors (C1, C2) shall be used between the power supply lines and ground
planes on the test board as shown in figure 11. The capacitor (C2) shall be placed as close as
possible to the measurement area of the power supply line to provide low RF impedance. The
distance between C2 and the via to the V land shall be no more than 25 mm as shown in
DD
figure 7. The capacitor (C1) shall be placed between the IC V land and the IC ground as
DD
shown in figure 9.

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61967-6 © IEC:2002 – 21 –
7.3.4 I/O pin loading
This measurement can be used to measure the RF current of a single I/O pin. The I/O pin
current shall be measured pin by pin. The layout of the pin loading shall be in accordance with
figures 8 and 9. This pin should be loaded with an impedance matching network with a
resistance of 150 Ω as shown in figure 11. The impedance matching network should be
loaded by a 50 Ω resistor (R3) or a 50 Ω input impedance of normal measurement equipment
(receiver).
DUT
A B
Layer 1
Ground
0,4 mm Ground Ground -Ground/signal
Layer 2
Signal Signal
0,4 mm V 1
DD -Power/signal
Layer 3
-Power/ground/signal
Ground and signal Ground and signal
0,6 mm V 2
DD
Layer 4
V and ground and signal VDD VDD V and ground and signal
DD DD
-Power/ground/signal
V (IC ground)
SS
Decoupling capacitor C1 for DUT
Layer thickness
Layer 1 : 0,035 mm (Recommended)
Insulator (Layer 1 to Layer 2) : 0,40 mm  (Recommended)
Layer 2 : 0,035 mm (Recommended)
Insulator (Layer 2 to Layer 3) : 0,40 mm (Recommended)
Layer 3 : 0,035mm (Recommended)
Insulator (Layer 3 to Layer 4) : 0,60mm (Strongly recommended)
Layer 4 : 0,035mm (Recommended)
IEC  1472/02
Figure 5 – Standardized IC test board – Sectional view 1
DUT
C D
Layer 1
-Ground/signal
0,4 mm Ground Ground Ground
Layer 2
-Power/signal
0,4 mm Signal V 1 Signal
DD
Layer 3
-Power/ground/signal
V 2
0,6 mm Ground and signal DD Ground and signal
Ground V and ground and Layer 4
DD
signal -Power/ground/signal
Power supply V (IC ground)
SS
pattern
Measurement power supply line
Decoupling capacitor C2
IEC  1473/02
Figure 6 – Standardized IC test board – Sectional view 2 – Measurement line
1,54 mm
1,54 mm

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61967-6 © IEC:2002 – 23 –
Via to V land: 0,8 mm diameter
DD
11 mm min.
Power supply strip width:
1,0 mm max.
Coplanar gap: 2,0 mm min.
Overlapped plane width between layer 3 and
layer 4 ground planes: 3,0 mm min.
Via: 0,8 mm diameter
Layer 3 (microstrip ground plane pattern)
Decoupling capacitors
(example: 0,1 µF each)
C2
Decoupling capacitor
(example: 10 µF)
Power supply line pattern
Peripheral ground plane
IEC  1474/02
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer
25 mm max.
14 mm min.

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61967-6 © IEC:2002 – 25 –
Via: 0,3 mm diameter
11 mm min.
Via: 0,8 mm diameter
I/O signal strip width: 0,3 mm
Coplanar gap: 2,0 mm min.
Layer 3 (microstrip ground plane pattern)
Overlapped plane width between
layer 3 and layer 4 ground planes:
3,0 mm min.
R1 = 120 Ω
C3 = 6,8 nF
R2 = 51 Ω
SMA connector
IEC  1475
...