SIST EN 61188-7:2010

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Leiterplatten und Flachbaugruppen – Konstruktion und Anwendung – Teil 7: Nullorientierung elektronischer Bauelemente für CAD-BibliotheksaufbauCartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 7: Orientation nulle des composants électroniques pour l'élaboration de la bibliothèque CAOPrinted board and printed board assemblies - Design and use -- Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 61188-7:2009SIST EN 61188-7:2010en,fr01-januar-2010SIST EN 61188-7:2010SLOVENSKI
STANDARD



SIST EN 61188-7:2010



EUROPEAN STANDARD EN 61188-7 NORME EUROPÉENNE
EUROPÄISCHE NORM July 2009
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: Avenue Marnix 17, B - 1000 Brussels
© 2009 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-7:2009 E
ICS 31.180
English version
Printed boards and printed board assemblies -
Design and use -
Part 7: Electronic component zero orientation
for CAD library construction (IEC 61188-7:2009)
Cartes imprimées
et cartes imprimées équipées -
Conception et utilisation -
Partie 7: Orientation nulle des composants électroniques pour l'élaboration
de la bibliothèque CAO (CEI 61188-7:2009)
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung -
Teil 7: Nullorientierung elektronischer Bauelemente für CAD-Bibliotheksaufbau
(IEC 61188-7:2009)
This European Standard was approved by CENELEC on 2009-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 61188-7:2010



EN 61188-7:2009
- 2 -
Foreword The text of document 91/854/FDIS, future edition 1 of IEC 61188-7, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61188-7 on 2009-06-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2010-03-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2012-06-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 61188-7:2009 was approved by CENELEC as a European Standard without any modification. __________
SIST EN 61188-7:2010



- 3 - EN 61188-7:2009 Annex ZA (normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 61182-2 -1) Printed board assembly products - Manufacturing description data and transfer methodology -
Part 2: Generic requirements
- -
IEC 61188-5-1 -1) Printed boards and printed board assemblies -Design and use -
Part 5-1: Attachment (land/joint) considerations - Generic requirements EN 61188-5-1 20022)
IEC 61188-5-2 -1) Printed boards and printed board assemblies -Design and use -
Part 5-2: Attachment (land/joint) considerations - Discrete components EN 61188-5-2 20032)
IEC 61188-5-3 -1) Printed boards and printed board assemblies -Design and use -
Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides EN 61188-5-3 20072)
IEC 61188-5-4 -1) Printed boards and printed board assemblies -Design and use -
Part 5-4: Attachment (land/joint)
consideration - Components with J-leads on two sides EN 61188-5-4 20072)
IEC 61188-5-5 -1) Printed boards and printed board assemblies -Design and use -
Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides EN 61188-5-5 20072)
IEC 61188-5-6 -1) Printed boards and printed board assemblies -Design and use -
Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides EN 61188-5-6 20032)
IEC 61188-5-8 -1) Printed boards and printed board assemblies -Design and use -
Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) EN 61188-5-8 20082)
1) Undated reference. 2) Valid edition at date of issue. SIST EN 61188-7:2010



SIST EN 61188-7:2010



IEC 61188-7Edition 1.0 2009-05INTERNATIONAL STANDARD
Printed boards and printed board assemblies – Design and use –
Part 7: Electronic component zero orientation for CAD library construction
INTERNATIONAL ELECTROTECHNICAL COMMISSION RICS 31.180 PRICE CODEISBN 2-8318-1043-2
® Registered trademark of the International Electrotechnical Commission ® SIST EN 61188-7:2010



– 2 – 61188-7 © IEC:2009(E) CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references.6 3 Basic rules.6 3.1 Common rules.6 3.2 General basic rules.7 3.3 Level A basic rule.7 3.4 Level B basic rules.7 3.5 File description definition.7 3.6 Component orientations.8 4 Origin point of land-pattern.16 4.1 General.16 4.2 Surface mount components.16 4.3 Through-hole leaded components.17 5 Land pattern to foot print comparison.18 6 Components with one terminal.18 6.1 Surface mount components.18 6.2 Through-hole leaded components.18
Figure 1 – Example of Level A orientation concepts.8 Figure 2 – Connector and switch library symbol examples.17 Figure 3 – Through-hole components with terminal point of origin orientation.17 Figure 4 – Circular or square one terminal component.18 Figure 5 – Rectangular or oval one terminal component.18 Figure 6 – Surface mount components with one lead offset.18
Table 1 – Discrete component land pattern conventions.9 Table 2 – Diode and transistor land pattern conventions.10 Table 3 – Transistor and IC land pattern conventions.11 Table 4 – Integrated circuit packages land pattern conventions.12 Table 5 – Integrated circuit packages land pattern conventions.13 Table 6 – BGA land pattern conventions.14 Table 7 – Resistor array and connector land pattern conventions.15 Table 8 – Level A land pattern convention summary.15 Table 9 – Level B land pattern convention summary.16
SIST EN 61188-7:2010



61188-7 © IEC:2009(E) – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 7: Electronic component zero orientation
for CAD library construction
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-7 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/854/FDIS 91/866/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. SIST EN 61188-7:2010



– 4 – 61188-7 © IEC:2009(E) A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies – Design and use, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be • reconfirmed, • withdrawn, • replaced by a revised edition, or • amended. A bilingual version of this publication may be issued at a later date. The contents of the corrigendum of July 2009 have been included in this copy.
SIST EN 61188-7:2010



61188-7 © IEC:2009(E) – 5 – INTRODUCTION One of the factors of establishing a CAD library component description and land pattern standard is to adopt a fixed zero component orientation so that all CAD images are built with the same rotation for the purpose of assembly machine automation. The land pattern standards clearly define all the properties necessary for standardization and acceptability of a one world CAD library. The main objective in defining a one world CAD library is to achieve the highest level of electronic product development automation. This encompasses all the processes involved from engineering to PCB layout to fabrication, assembly and test. The data format standards need this type of consistency in order to meet the efficiency that electronic data transfer can bring to the industry. Many large firms have spent millions of dollars creating and implementing their own unique standards for their own electronic product development automation. These standards are proprietary to each firm and are not openly shared with the rest of the industry. This has resulted in massive duplication of effort costing the industry millions of man hours in waste and creating industry chaos and global non-standardization. The industry associations responsible for component descriptions and tape and reel orientation have tried valiantly to influence the industry by making good standards that describe the component outlines and how they should be positioned in the delivery system to the equipment on the manufacturing floor. Suppliers of parts have either not adhered to the recommendations or have misunderstood the intent and provided their products in different orientations. The Land pattern standards (IEC 61188-5-1, IEC 61188-5-2, IEC 61188-5-3, IEC 61188-5-4, IEC 61188-5-5, IEC 61188-5-6 and IEC 61188-5-8) put an end to the proprietary intellectual property and introduce a world standard so every electronics firm can benefit from electronic product development automation. The data format standards (IPC-2581 and IEC 61182-2) are an open database XML software code that is neutral to all the various CAD ASCII formats. For true machine automation to exist, the world desperately needs a neutral CAD database format that all PCB manufacturing machines can read. The main purpose of creating the land pattern standards is to achieve reliable solder joint formation platforms; the reason for developing the data transfer structure is to improve the efficiency with which engineering intelligence is converted to manufacturing reality. Even if the neutral CAD format can drive all the manufacturing machines, it would be meaningless unless the component description standard for CAD land patterns was implemented with some consistency. Zero component orientation has a key role in machine automation. The obvious choice for global standardization for EE hardware engineering, PCB design layout, manufacturing, assembly and testing processes is to incorporate the standard land pattern conventions. Any other option continues the confusion and additional manual hours of intervention in order to achieve the goals of automation. In addition, the ease of having one system export a file so that another system can accomplish the work may require unnecessary manipulation of the neutral format in order to meet the object of clear, unam
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