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SIST EN 123200:2001

(Main)

Sectional Specification: Single and double sided printed boards with plated-through holes

Sectional Specification: Single and double sided printed boards with plated-through holes

Supersedes CECC 23 200:1985 * D97/081: CECC/SC 52 disbanded

Rahmenspezifikation: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Löchern

Spécification intermédiaire: Cartes imprimées simples et doubles faces avec trous métallisés

Sectional Specification: Single and double sided printed boards with plated-through holes

General Information

Status
Published
Publication Date
28-Feb-2001
ICS
31.180 - Printed circuits and boards
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Mar-2001
Due Date
01-Mar-2001
Completion Date
01-Mar-2001
Ref Project
EN 123200:1992 - Sectional Specification: Single and double sided printed boards with plated-through holes

Relations

Amended By
SIST EN 123200:2001/A1:1997 - Sectional Specification: Single and double sided printed boards with plated-through holes
Effective Date
28-Jan-2023
Amended By
SIST EN 123200:2001/A1:1997 - Sectional Specification: Single and double sided printed boards with plated-through holes
Effective Date
01-Aug-1997

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Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Sectional Specification: Single and double sided printed boards with plated-through holesRahmenspezifikation: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten LöchernSpécification intermédiaire: Cartes imprimées simples et doubles faces avec trous métallisésSectional Specification: Single and double sided printed boards with plated-through holes31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 123200:1992SIST EN 123200:2001en01-marec-2001SIST EN
...

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