Semiconductor devices - Mechanical and climatic test methods -- Part 1: General

Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 1: Allgemeines

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 1: Généralités

Applicable aux dispositifs à semiconducteurs (dispositifs discrets et circuits intégrés)et établit des dispositions communes à toutes les autres parties de la série.

Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002)

General Information

Status
Published
Publication Date
30-Jun-2004
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Jul-2004
Due Date
01-Jul-2004
Completion Date
01-Jul-2004

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SLOVENSKI SIST EN 60749-1:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
(IEC 60749-1:2002)
ICS 31.080.01 Referenčna številka
SIST EN 60749-1:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2003

ICS 31.080.01 Supersedes EN 60749:1999 + A1:2000 + A2:2001


English version


Semiconductor devices -
Mechanical and climatic test methods
Part 1: General
(IEC 60749-1:2002)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische Prüfverfahren
et climatiques Teil 1: Allgemeines
Partie 1: Généralités (IEC 60749-1:2002)
(CEI 60749-1:2002)






This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-1:2003 E

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EN 60749-1:2003 - 2 -
Foreword
The text of document 47/1638/FDIS, future edition 1 of IEC 60749-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-1 on 2002-09-24.
This European Standard, together with the other parts of the series EN 60749, supersedes
EN 60749:1999 + A1:2000 + A2:2001, in which the test methods were contained in one standard
which was subdivided into chapters relating to mechanical test methods, climatic test methods and
miscellaneous test methods.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-10-01
Each test method governed by this standard and which is part of the series is a stand-alone
document, numbered EN 60749-2, EN 60749-3, etc. The numbering of these test methods is
sequential, and there is no relationship between the number and the test method (i.e. no grouping of
test methods). The list of these tests will be available in the CENELEC internet site and in the
catalogue.
Updating of any of the individual test methods is independent of any other part.
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-1:2002 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60749-1:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical - -
Vocabulary (IEV)

IEC 60747 Series Semiconductor devices - Discrete EN 60747 Series
devices

IEC 60748 Series Semiconductor devices - Integrated - -
circuits

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NORME CEI
INTERNATIONALE IEC
60749-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-08
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 1:
Généralités
Semiconductor devices –
Mechanical and climatic test methods –
Part 1:
General
 IEC 2002 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
CODE PRIX
H
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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60749-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD . 5
INTRODUCTION .9
1 Scope .11
2 Normative references.11
3 Terms, definitions and letter symbols.11
4 Standard atmospheric conditions .11
5 Electrical measurements.13
6 Use of electrically defective devices .13

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60749-1 © IEC:2002 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 1: General
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as
...

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