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---------------------- Page: 1 ----------------------

EUROPEAN STANDARD
EN 61189-5

NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM

ICS 31.180


English version


Test methods for electrical materials, interconnection structures
and assemblies
Part 5: Test methods for printed board assemblies
(IEC 61189-5:2006)


Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les structures Verbindungsstrukturen
d'interconnexion et les ensembles und Baugruppen
Partie 5: Méthodes d'essais Teil 5: Prüfverfahren
pour les cartes imprimées équipées für bestückte Leiterplatten
(CEI 61189-5:2006) (IEC 61189-5:2006)




This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-5:2006 E

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EN 61189-5:2006 - 2 -
Foreword
The text of document 91/564/FDIS, future edition 1 of IEC 61189-5, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-5 on 2006-09-01.
This standard forms part of a series and should be used in conjunction with other parts in the same
series, under the main title Test methods for electrical materials, interconnection structures and
assemblies:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in electronic assemblies
It should also be read in conjunction with EN 60068, Environmental testing.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-5:2006 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 61189-5:2006
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance


2) 3)
IEC 60068-2-20 - Environmental testing HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering


2) 3)
IEC 61189-1 - Test methods for electrical materials, printed EN 61189-1 1997
boards and other interconnection structures
and assemblies
Part 1: General test methods and
methodology


2) 3)
IEC 61189-3 - Test methods for electrical materials, printed EN 61189-3 1997
boards and other interconnection structures
and assemblies
Part 3: Test methods for interconnection
structures (printed boards)


2) 3)
IEC 61189-6 - Test methods for electrical materials, EN 61189-6 2006
interconnection structures and assemblies
Part 6: Test methods for materials used in
manufacturing electronic assemblies


2) 3)
IEC 61190-1-1 - Attachment materials for electronic assembly EN 61190-1-1 2002
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly


IEC 61190-1-2 2002 Attachment materials for electronic assembly EN 61190-1-2 2002
Part 1-2: Requirements for solder pastes for
high-quality interconnections in electronics
assembly


2) 3)
IEC 61190-1-3 - Attachment materials for electronic assembly EN 61190-1-3 2002
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications



1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated reference.
3)
Valid edition at date of issue.

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EN 61189-5:2006 - 4 -
Publication Year Title EN/HD Year
2) 3)
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad


IEC 62137 2004 Environmental and endurance testing - Test EN 62137 2004
+ corr. January 2005 methods for surface-mount boards of area + corr. February 2005
array type packages FBGA, BGA, FLGA,
LGA, SON and QFN


2)
ISO 5725-2 - Accuracy (trueness and precision) of - -
measurement methods and results
Part 2: Basic method for the determination of
repeatability and reproducibility of a standard
measurement method


2) 3)
ISO 9001 - Quality management systems - EN ISO 9001 2000
Requirements


2) 3)
ISO 9455-1 - Soft soldering fluxes - Test methods EN 29455-1 1993
Part 1: Determination of non-volatile matter,
gravimetric method


2) 3)
ISO 9455-2 - Soft soldering fluxes - Test methods EN ISO 9455-2 1995
Part 2: Determination of non-volatile matter,
ebulliometric method

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INTERNATIONAL IEC


STANDARD 61189-5





First edition
2006-08


Test methods for electrical materials,
interconnection structures and assemblies –
Part 5:
Test methods for printed board assemblies
 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XB
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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– 2 – 61189-5  IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 Accuracy, precision and resolution .8
3.1 Accuracy .8
3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s t distribution.10
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
5.1 Test 5P01: Test-board design guideline.11
5.2 Test 5P02: Standard mounting process for CSP/BGA packages .11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 5C01: Corrosion, flux.11
9 M: Mechanical test methods .14
9.1 Test 5M01: Peel test method for test-board land .14
10 E: Electrical test methods .14
10.1 Test 5E01: Changes of the surface insulation resistance caused by fluxes .14
10.2 Test 5E02: Surface insulation resistance, assemblies .21
11 N Environmental test methods .30
11.1 Test 5N01: Reflow solderability test for soldering joint.30
11.2 Test 5N02: Resistance to reflow solderability of test board.30
11.3 Test 5N03: Solderability test for test-board land .30
12 X Miscellaneous test methods .30
12.1 Test 5X01: Liquid flux activity, wetting balance method .30
12.2 Test 5X02: Paste flux viscosity – T-Bar spindle method.34
12.3 Test 5X03: Spread test, liquid or extracted solder flux, solder paste and
extracted cored wires or preforms .34
12.4 Test 5X04: Solder paste viscosity – T-Bar spin spindle method (applicable to
300 Pa·s to 1,600 Pa·s) .37
12.5 Test 5X05: Solder paste viscosity – T-Bar spindle method (applicable to 300
Pa·s) .40
12.6 Test 5X06: Solder paste viscosity – Spiral pump method (applicable to
300 Pa·s to 1,600 Pa·s) .42
12.7 Test 5X07: Solder paste viscosity – Spiral pump method (applicable to 300
Pa·s) .44
12.8 Test 5X08: Solder paste − Slump test.47
12.9 Test 5X09: Solder paste − Solder ball test.51
12.10 Test 5X10: Solder paste − Tack test .53
12.11 Test 5X11: Solder paste − Wetting test.55

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61189-5  IEC:2006(E) – 3 –
12.12 Test 5X12: Flux residues – Tackiness after drying.56
12.13 Test 5X13: Spitting of flux-cored wire solder.58
12.14 Test 5X14: Solder pool test .60

Bibliography.62

Figure 1 – Surface insulation resistance pattern .14
Figure 2 – Connector arrangement.17
Figure 3 – Specimen orientation in test chamber.18
Figure 4 – Test method 5E02.23
Figure 5 – Resistor verification coupon .24
Figure 6 – Resistor verification board with protective cover.25
Figure 7 – Test specimen location with respect to chamber air flow .25
Figure 8 – Wetting balance apparatus.32
Figure 9 – Wetting balance curve.33
Figure 10 – Slump test stencil thickness, 0,20 mm.48
Figure 11 – Slump test stencil thickness, 0,10 mm.49
Figure 12 – Solder ball test evaluation .52
Figure 13 – Solder wetting examples .56
Figure 14 – Test apparatus for spitting test .59

Table 1 – Student’s t distribution.10
Table 2 – Coupons for surface insulation resistance (SIR) testing.16
Table 3 – Qualification test report .21
Table 4 – Suggested test conditions .27
2
Table 5 – Typical spread areas defined in mm .35
Table 6 – Example of a test report on solder paste .39
Table 7 – Example of a test report on solder paste .41
Table 8 – Example of a test report on solder paste .43
Table 9 – Example of a test report on solder paste .46
Table 10 – Example of a test report – Stencil thickness, 0,2 mm.50
Table 11 – Example of a test report – Stencil thickness, 0,1 mm.50

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– 4 – 61189-5  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5: Test methods for printed board assemblies


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-5 has been prepared by IEC technical committee 91:
Electronic assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/608/FDIS 91/619/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

---------------------- Page: 9 ----------------------

61189-5  IEC:2006(E) – 5 –
This standard is to be used in conjunction with the following parts of IEC 61189:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 6: Test methods for materials used in electronic assemblies
and also the following standard:
IEC 60068: Environmental testing
The list of all the parts of the IEC 61189 series, under the general title Test methods for
electrical materials, interconnection structures and assemblies, can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC website under http://webstore.iec.ch in the
data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

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– 6 – 61189-5  IEC:2006(E)
INTRODUCTION
IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as
related materials or component robustness, irrespective of their method of manufacture.
The standard is divided into separate parts, covering information for the designer and the test
methodology engineer or technician. Each part has a specific focus; methods are grouped
according to their application and numbered sequentially as they are developed and released.
In some instances test methods developed by other TCs (for example, TC 104) have been
reproduced from existing IEC standards in order to provide the reader with a comprehensive
set of test methods. When this situation occurs, it will be noted on the specific test method; if
the test method is reproduced with minor revision, those paragraphs that are different are
identified.
This part of IEC 61189 contains test methods for evaluating printed board assemblies. The
methods are self-contained, with sufficient detail and description so as to achieve uniformity
and reproducibility in the procedures and test methodologies.
The tests shown in this standard are grouped according to the following principles:
P: preparation/conditioning methods
V: visual test methods
D: dimensional test methods
C: chemical test methods
M: mechanical test methods
E: electrical test methods
N: environmental test methods
X: miscellaneous test methods
To facilitate reference to the tests, to retain consistency of presentation, and to provide for
future expansion, each test is identified by a number (assigned sequentially) added to the
prefix (group code) letter showing the group to which the test method belongs.
The test method numbers have no significance with respect to an eventual test sequence; that
responsibility rests with the relevant specification that calls for the method being performed.
The relevant specification, in most instances, also describes pass/fail criterion.
The letter and number combinations are for reference purposes to be used by the relevant
specification. Thus "5C01" represents the first chemical test method described in IEC 61189-5.
In short, in this example, 5 is the number of the part of IEC 61189, C is the group of methods,
and 01 is the test number.
A list of all test methods included in this standard, as well as those under consideration, is
given in Annex B. This annex will be reissued whenever new tests are introduced.

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61189-5  IEC:2006(E) – 7 –
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5: Test methods for printed board assemblies



1 Scope
This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T:Soldering
IEC 61189-1, Test methods for electrical materials, interconnection structures and assemblies
– Part 1: General test methods and methodology
IEC 61189-3, Test methods for electrical materials, interconnection structures and assemblies
– Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies
– Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2:2002, Attachment materials for electronic assembly – Part 1-2: Requirements
for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly– Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad
IEC 62137:2004, Environmental and endurance testing - Test methods for surface-mount
boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
ISO 5725-2, Accuracy (trueness and precision) of measurement methods and results – Part 2:
Basic method for the determination of repeatability and reproducibility of a standard
measurement method
ISO 9001, Quality management systems – Requirements

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– 8 – 61189-5  IEC:2006(E)
ISO 9455-1, Soft soldering fluxes – Test methods – Part 1: Determination of non-volatile
matter, gravimetric method
ISO 9455-2, Soft soldering fluxes –Test methods – Part 2: Determination of non-volatile
matter, ebulliometric method
3 Accuracy, precision and resolution
Errors and uncertainties are inherent in all measurement processes. The information given
below enables valid estimates of the amount of error and uncertainty to be taken into account.
Test data serve a number of purposes which include
– monitoring of a process;
– enhancing of confidence in quality conformance;
– arbitration between customer and supplier.
In any of these circumstances, it is essential that confidence can be placed upon the test data
in terms of
– accuracy: calibration of the test instruments and/or system;
– precision: the repeatability and uncertainty of the measurement;
– resolution: the suitability of the test instrument and/or system.
3.1 Accuracy
The regime by which routine calibration of the test equipment is undertaken shall be clearly
stated in the quality documentation of the supplier or agency conducting the test and shall
meet the requirements of ISO 9001.
The calibration shall be conducted by an agency having accreditation to a national or
international measurement standard institute. There should be an uninterrupted chain of
calibration to a national or international standard.
Where calibration to a national or international standard is not possible, round-robin
techniques may be used and documented to enhance confidence in measurement accuracy.
The calibration interval shall normally be one year. Equipment consistently found to be
outside acceptable limits of accuracy shall be subject to shortened calibration intervals.
Equipment consistently found to be well within acceptable limits may be subject to relaxed
calibration intervals.
A record of the calibration and maintenance history shall be maintained for each instrument.
These records should state the uncertainty of the calibration technique (in ± % deviation) in
order that uncertainties of measurement can be aggregated and determined.
A procedure shall be implemented to resolve any situation where an instrument is found to be
outside calibration limits.
3.2 Precision
The uncertainty budget of any measurement technique is made up of both systematic and
random uncertainties. All estimates shall be based upon a single confidence level, the
minimum being 95 %.
Systematic uncertainties are usually the predominant contributor and will include all
uncertainties not subject to random fluctuation. These include

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