SIST EN 62739-1:2014

SLOVENSKI STANDARD
SIST EN 62739-1:2014
01-maj-2014
Preskusna metoda za opremo za valovno spajkanje, ki uporablja staljeno
spajkalno zlitino brez svinca - 1. del: Metoda z erozijskim preskušanjem kovinskih
materialov brez površinske obdelave (IEC 62739-1:2013)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- Part 1: Erosion test method for metal materials without surface processing
Verfahren zur Erosionsprüfung für Wellenlötausrüstungen bei Verwendung von
geschmolzener, bleifreier Lotlegierung - Teil 1: Erosionsprüfverfahren für metallische
Werkstoffe ohne Oberflächenbehandlung
/
Ta slovenski standard je istoveten z: EN 62739-1:2013
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
SIST EN 62739-1:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62739-1:2014

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SIST EN 62739-1:2014

EUROPEAN STANDARD
EN 62739-1

NORME EUROPÉENNE
August 2013
EUROPÄISCHE NORM

ICS 31.190; 31.240


English version

Test method for erosion of wave soldering equipment using molten lead-
free solder alloy -
Part 1: Erosion test method for metal materials without surface
processing
(IEC 62739-1:2013)


Méthode d'essai de l'érosion de Verfahren zur Erosionsprüfung für
l'équipement de brasage à la vague Wellenlötausrüstungen bei Verwendung
utilisant un alliage à braser sans plomb von geschmolzener, bleifreier Lotlegierung
fondu - -
Partie 1: Méthode d'essai d'érosion des Teil 1: Erosionsprüfverfahren für
matériaux métalliques sans traitement de metallische Werkstoffe ohne
surface Oberflächenbehandlung
(CEI 62739-1:2013) (IEC 62739-1:2013)




This European Standard was approved by CENELEC on 2013-07-23. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62739-1:2013 E

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SIST EN 62739-1:2014
EN 62739-1:2013 - 2 -

Foreword
The text of document 91/1092/FDIS, future edition 1 of IEC 62739-1, prepared by IEC TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 62739-1:2013.
The following dates are fixed:
(dop) 2014-04-23
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-07-23
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62739-1:2013 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:

IEC 60194:2006 NOTE  Harmonized as EN 60194:2006.

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SIST EN 62739-1:2014
- 3 - EN 62739-1:2013

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by
(mod), the relevant EN/HD applies.

Publication Year Title EN/HD Year

IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads


IEC 61190-1-3 Attachment materials for electronic EN 61190-1-3
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

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SIST EN 62739-1:2014

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SIST EN 62739-1:2014




IEC 62739-1

®


Edition 1.0 2013-06




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Test method for erosion of wave soldering equipment using molten lead-free

solder alloy –

Part 1: Erosion test method for metal materials without surface processing




Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un

alliage à braser sans plomb fondu –


Partie 1: Méthode d'essai d'érosion de matériaux métalliques sans traitement de

surface












INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX R


ICS 31.190; 31.240 ISBN 978-2-83220-870-0



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62739-1:2014
– 2 – 62739-1 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test . 6
4.1 Overview . 6
4.2 Test equipment . 6
4.2.1 Test equipment description . 6
4.2.2 Configuration example of test equipment . 6
4.3 Specimen . 7
4.4 Test conditions . 9
4.5 Test method . 9
4.5.1 Test procedure . 9
4.5.2 Dross removal procedure . 10
5 Method of erosion depth measurement (focal depth method with optical
microscope) . 10
5.1 General . 10
5.2 Preparation of the specimen . 10
5.3 Measurement equipment . 10
5.4 Measurement procedure . 11
6 Items to be recorded in test report . 12
Annex A (normative) Specifications of test equipment & measurement equipment . 13
Annex B (informative) Method of estimation of maximum erosion depth by extreme
value statistical analysis . 15
Bibliography . 18

Figure 1 – Configuration example of test equipment . 7
Figure 2 – Shape of the specimen . 8
Figure 3 – Example of measurement equipment configuration for the focal depth
method using an optical microscope . 11
Figure B.1 – Example of section division of plate specimen . 15
Figure B.2 – Estimated maximum erosion depth for N = 8 . 17

Table 1 – Test conditions . 9

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SIST EN 62739-1:2014
62739-1 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHOD FOR EROSION OF WAVE SOLDERING
EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY –

Part 1: Erosion test method for metal materials
without surface processing

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62739-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1092/FDIS 91/1106/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62739-1:2014
– 4 – 62739-1 © IEC:2013
A list of all parts in the IEC 62739 series, published under the general title Test method for
erosion of wave soldering equipment using molten lead-free solder alloy, can be found on the
IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 62739-1:2014
62739-1 © IEC:2013 – 5 –
TEST METHOD FOR EROSION OF WAVE SOLDERING
EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY –

Part 1: Erosion test method for metal materials
without surface processing



1 Scope
This part of the IEC 62739 series provides an evaluating test method for the erosion of the
metallic materials without surface processing intended to be used for lead-free wave soldering
equipment as a solder bath and other components which are in contact with the molten solder.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering
applications
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
erosion
phenomenon where a base material is dissolved and made thinner by coming into contact with
molten solder
3.2
lead-free solder
alloy that does not contain more than 0,1 % mass fraction of lead (Pb) as its constituent and
is used for joining components to substrates or for coating surfaces
[SOURCE: IEC 60194:2006, 75.1904 modified — "mass fraction" is used instead of "weight"]
3.3
dross
oxide and other contaminants that form on the surface of molten solder
[SOURCE: IEC 60194:2006, 75.0410]

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SIST EN 62739-1:2014
– 6 – 62739-1 © IEC:2013
4 Test
4.1 Overview
The specimen is mounted to the rotation block of the test equipment which is driven by the
motor (may include gear unit) then immersed into molten lead-free solder and rotated to
...