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EUROPEAN STANDARD
EN 61189-6

NORME EUROPÉENNE
August 2006
EUROPÄISCHE NORM

ICS 31.180


English version


Test methods for electrical materials,
interconnection structures and assemblies
Part 6: Test methods for materials used in
manufacturing electronic assemblies
(IEC 61189-6:2006)


Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les structures Verbindungsstrukturen und Baugruppen
d'interconnexion et les ensembles Teil 6: Prüfverfahren für Materialien,
Partie 6: Méthodes d'essais pour die bei der Herstellung elektronischer
les matériaux utilisés dans la fabrication
Baugruppen eingesetzt werden
des assemblages électroniques (IEC 61189-6:2006)
(CEI 61189-6:2006)




This European Standard was approved by CENELEC on 2006-08-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-6:2006 E

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EN 61189-6:2006 - 2 -
Foreword
The text of document 91/593/FDIS, future edition 1 of IEC 61189-6, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-6 on 2006-08-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-05-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-08-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-6:2006 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 61189-6:2006

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance


2) 3)
IEC 61189-1 - Test methods for electrical materials, EN 61189-1 1997
interconnection structures and assemblies
Part 1: General test methods and
methodology


2) 3)
IEC 61190-1-1 - Attachment materials for electronic assembly EN 61190-1-1 2002
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly


2) 3)
IEC 61190-1-3 - Attachment materials for electronic assembly EN 61190-1-3 2002
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications


2) 3)
ISO 9001 - Quality management systems - Requirements EN ISO 9001 2000


ISO 9455 Series Soft soldering fluxes - Test methods EN ISO 9455 Series







1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated reference.
3)
Valid edition at date of issue.

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INTERNATIONAL IEC


STANDARD 61189-6





First edition
2006-07


Test methods for electrical materials,
interconnection structures and assemblies –
Part 6:
Test methods for materials used
in manufacturing electronic assemblies
 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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– 2 – 61189-6  IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 Accuracy, precision and resolution .7
3.1 Accuracy .8
3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s "t" distribution .9
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 6C01: Determination of acid value of liquid soldering flux 
potentiometric and visual titration methods.11
8.2 Test 6C02: Determination of halides in fluxes, silver chromate method.14
8.3 Test 6C03: Solids content, flux .16
8.4 Test 6C04: Quantitative determination of halide content in fluxes (chloride
and bromide) .17
8.5 Test 6C05: Qualitative analysis of fluorides and fluxes by spot test .22
8.6 Test 6C06: Quantitative determination of fluoride concentration in fluxes .23
8.7 Test 6C07: Acid number of rosin .26
8.8 Test 6C08: Specific gravity.26
8.9 Test 6C09: Determination of the percentage of flux on/in flux-coated and/or
flux-cored solder .27
8.10 Test 6C10: Flux induced corrosion (copper mirror method).28
9 M: Mechanical test methods .30
10 E: Electrical test methods .30
11 N: Environmental test methods.30
12 X: Miscellaneous test methods .31
12.1 Test 6X01: Determination of solder powder particle size distribution – Screen
method for types 1-4 .31
12.2 Test 6X02: Solder powder particle size distribution-measuring microscope
method.33
12.3 Test 6X03: Solder powder particle size distribution – Optical image analyser
method.34
12.4 Test 6X04: Solder powder particle size distribution – Measuring laser
diffraction method.36
12.5 Test 6X05: Determination of maximum solder powder particle size.38
12.6 Test 6X06: Solder paste metal content by weight .39

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61189-6  IEC:2006(E) – 3 –

Figure 1 – Chlorides and/or bromides test results .16
Figure 2 – Test equipment of specific gravity (hydrometer reading).26
Figure 3 – Flux type classification by copper mirror test.30

Table 1 – Student’s "t" distribution .10
Table 2 – Relation between halide content and mass of specimen .20
Table 3 – Mixing ratio from specimen size to water quantity.23
Table 4 – Specimen size to chloroform mixture .24
Table 5 – Screen opening .32
Table 6 – Portions of particle sizes by weight % – nominal values .32
Table 7 – Powder particle size distribution record .32
Table 8 – Powder particle size distribution record .34
Table 9 – Powder particle size distribution record (optical analysis) .36
Table 10 – Powder particle size distribution record .37
Table 11 – Acceptance of powders by particle sizes .38
Table 12 – Test report on solder paste.39
Table 13 – Test report on solder paste.41

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– 4 – 61189-6  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 6: Test methods for materials used
in manufacturing electronic assemblies


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-6 has been prepared by IEC technical committee 91:
Electronic assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/593/FDIS 91/610/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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61189-6  IEC:2006(E) – 5 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This standard should be used in conjunction with the following parts of IEC 61189, under the
main title Test methods for electrical materials, interconnection structures and assemblies:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 5: Test methods for printed board assemblies,
and also the following standard:
IEC 60068: Environmental testing
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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– 6 – 61189-6  IEC:2006(E)
INTRODUCTION
IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as
related materials or component robustness, irrespective of their method of manufacture.
The IEC 61189 series is divided into separate parts, covering information for the designer and
the test methodology engineer or technician. Each part has a specific focus; methods are
grouped according to their application and numbered sequentially as they are developed and
released.
In some instances test methods developed by other TCs (e.g. TC 104) have been reproduced
from existing IEC standards in order to provide the reader with a comprehensive set of test
methods. When this situation occurs, it will be noted on the specific test method; if the test
method is reproduced with minor revision, those paragraphs that are different are identified.
This part of IEC 61189 contains test methods for evaluating materials used in manufacturing
electronic assemblies. The methods are self-contained, with sufficient detail and description
so as to achieve uniformity and reproducibility in the procedures and test methodologies.
The tests shown in this standard are grouped according to the following principles:
P: preparation/conditioning methods
V: visual test methods
D: dimensional test methods
C: chemical test methods
M: mechanical test methods
E: electrical test methods
N: environmental test methods
X: miscellaneous test methods
To facilitate reference to the tests, to retain consistency of presentation, and to provide for
future expansion, each test is identified by a number (assigned sequentially) added to the
prefix (group code) letter showing the group to which the test method belongs.
The test method numbers have no significance with respect to an eventual test sequence; that
responsibility rests with the relevant specification that calls for the method being performed.
The relevant specification, in most instances, also describes pass/fail criterion.
The letter and number combinations are for reference purposes, to be used by the relevant
specification. Thus "6C02" represents the s chemical test method described in this “Part 6” of
IEC 61189. In this example, 6 is the part of IEC standard (61189-6), C is the group of
methods, and 02 is the test number.

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61189-6  IEC:2006(E) – 7 –
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 6: Test methods for materials used
in manufacturing electronic assemblies



1 Scope
This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to materials used in manufacturing electronic assemblies.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 61189-1, Test methods for electrical materials, interconnection structures and assemblies
– Part 1: General test methods and methodology
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
ISO 9001, Quality management systems – Requirements
ISO 9455 (all parts), Soft soldering fluxes – Test methods
3 Accuracy, precision and resolution
Errors and uncertainties are inherent in all measurement processes. The information given
below enables valid estimates of the amount of error and uncertainty to be taken into account.
Test data serve a number of purposes which include:
– monitoring a process;
– enhancing confidence in quality conformance;
– arbitrating between customer and supplier.
In any of these circumstances, it is essential that confidence can be placed upon the test data
in terms of
– accuracy; calibration of the test instruments and/or system,
– precision; the repeatability and uncertainty of the measurement,
– resolution; the suitability of the test instrument and/or system.

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– 8 – 61189-6  IEC:2006(E)
3.1 Accuracy
The regime by which routine calibration of the test equipment is undertaken shall be clearly
stated in the quality documentation of the supplier or agency conducting the test, and shall
meet the requirements of ISO 9001.
The calibration shall be conducted by an agency having accreditation to a national or
international measurement standard institute. There should be an uninterrupted chain of
calibration to a national or international standard.
Where calibration to a national or international standard is not possible, “round robin"
techniques may be used and documented to enhance confidence in measurement accuracy.
The calibration interval shall normally be one year. Equipment consistently found to be
outside acceptable limits of accuracy shall be subject to shortened calibration intervals.
Equipment consistently found to be well within acceptable limits may be subject to relaxed
calibration intervals.
A record of the calibration and maintenance history shall be maintained for each instrument.
These records should state the uncertainty of the calibration technique (in ± % deviation) in
order that uncertainties of measurement can be aggregated and determined.
A procedure shall be implemented to resolve any situation where an instrument is found to be
outside calibration limits.
3.2 Precision
The uncertainty budget of any measurement technique is made up of both systematic and
random uncertainties. All estimates shall be based upon a single confidence level, the
minimum being 95 %.
Systematic uncertainties are usually the predominant contributor, and will include all
uncertainties not subject to random fluctuation. These include:
– calibration uncertainties;
– errors due to the use of an instrument under conditions which differ from those under
which it was calibrated;
– errors in the graduation of a scale of an analogue meter (scale shape error).
Random uncertainties result from numerous sources but can be deduced from repeated
measurement of a standard item. Therefore, it is not necessary to isolate the individual
contributions. These may include:
– random fluctuations such as those due to the variation of an influence parameter.
Typically, changes in atmospheric conditions reduce the repeatability of a measurement;
– uncertainty in discrimination, such as setting a pointer to a fiducial mark, or interpolating
between graduations on an analogue scale.
Aggregation of uncertainties: geometric addition (root-sum-square) of uncertainties may be
used in most cases. Interpolation error is normally added separately and may be accepted as
being 20 % of the difference between the finest graduations of the scale of the instrument:
2 2
U = ± (U + U ) + U
t s r i
where
U is the total uncertainty;
t
U is the systematic uncertainty;
s

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61189-6  IEC:2006(E) – 9 –
U is the random uncertainty;
r
U is the interpolation error.
i
Determination of random uncertainties: random uncertainty can be determined by repeated
measurement of a parameter, and subsequent statistical manipulation of the measured data.
The technique assumes that the data exhibits a normal (Gaussian) distribution:
t × σ
U =
r
n
where
U is random uncertainty;
r
n is the specimen size;
t is the percentage point of the "t" distribution from 3.5, statistical tables;
σ is the standard deviation (σ ).
n–1
3.3 Resolution
It is paramount that the test equipment used is capable of sufficient resolution. Measurement
systems used should be capable of resolving 10 % (or better) of the test limit tolerance.
It is accepted that some technologies will place a physical limitation upon resolution (e.g.
optical resolution).
3.4 Report
In addition to requirements detailed in the test specification, the report shall detail:
a) the test method used;
b) the identity of the specimen(s);
c) the test instrumentation;
d) the specified limit(s);
e) an estimate of measurement uncertainty, and resultant working limit(s) for the test;
f) the detailed test results;
g) the test date, and operators’ signature.
3.5 Student’s "t" distribution
Table 1 gives values of the factor "t" for 95 % and 99 % confidence levels, as a function of the
number of measurements. It is sufficient to use a 95 % limit, as in the case of the worked
examples shown in Annex A.

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– 10 – 61189-6  IEC:2006(E)
Table 1 – Student’s "t" distribution
Specimen Specimen
t value t value t value t value
size size
95 % 99 % 95 % 99 %
2 12,7 63,7 14 2,16 3,01
3 4,3 9,92 15 2,14 2,98
4 3,18 5,84 16 2,13 2,95
5 2,78 4,6 17 2,12 2,92
6 2,57 4,03 18 2,11 2,9
7 2,45 3,71 19 2,1 2,88
8 2,36 3,5 20 2,09 2,86
9 2,31 3,36 21 2,08 2,83
10 2,26 3,25 22 2,075 2,82
11 2,23 3,17 23 2,07 v2,81
12 2,2 3,11 24 2,065 2,8
13 2,18 3,05 25 2,06 2,79

3.6 Suggested uncertainty limits
The following target uncertainties are suggested:
a) voltage <1 kV: ±1,5 %
b) voltage >1 kV: ±2,5 %
c) current <20 A: ±1,5 %
d) current >20 A: ±2,5 %
Resistance
e) earth and continuity: ±10 %
f) insulation: ±10 %
g) frequency: ±0,2 %
Time
h) interval <60 s: ±1 s
i) interval >60 s: ±2 %
j) mass <10 g: ±0,5 %
k) mass (10 – 100) g: ±1 %
l) mass >100 g: ±2 %
m) force: ±2 %
n) dimension <25 mm: ±0,5 %
o) dimension >25 mm: ±0,1 mm
p) temperature <100 °C: ±1,5 %
q) temperature >100 °C: ±3,5 %
r) humidity (30 – 75) % RH: ±5 % RH

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61189-6  IEC:2006(E) – 11 –
Plating thicknesses
s) backscatter method: ±10 %
t) microsection: ±2 microns
u) ionic contamination: ±10 %
4 Catalogue of approved test methods
This standard provides specific test methods in complete detail to permit implementation with
minimal cross-referencing to other specific procedures. The use of generic conditioning
exposures is accomplished in the methods by reference, for example those described in
IEC 61189-1 and IEC 60068-1 and, when applicable, is a mandatory part of the test method
standard.
Each method has its own title, number and revision status to accommodate updating and
improving the methods as industry requirements change or demand new methodology. The
methods are organized into test method groups and individual tests.
5 P: Preparation/conditioning test methods
Under consideration.
6 V: Visual test methods
Under consideration.
7 D: Dimensional test methods
Under consideration.
8 C: Chemical test methods
8.1 Test 6C01: Determination of acid value of liquid soldering flux  Potentiometric
and visual titration methods
8.1.1 Object
This test method specifies two methods for the determination of the acid value of a flux of
types L, M. or H.
Method A is a potentiometric titration method and is to be considered as the reference
method.
Method B is an alternative, visual end-point, titration method.
See ISO 9455 for reference.
8.1.2 Test specimen
A minimum of 2,0 g of liquid flux, 10 g of solder paste, 150 g of cored wire or 10 g of solder
preforms.

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...