Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

This part of IEC 62137 specifies the test method for the solder joints of area array type
packages mounted on the printed wiring board to evaluate solder joint durability against
thermo-mechanical stress.
This part of IEC 62137 applies to the surface mounting semiconductor devices with area array
type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages
(SON and QFN) that are intended to be used in industrial and consumer electrical or
electronic equipment.
An acceleration factor for the degradation of the solder joints of the packages by the
temperature cycling test due to the thermal stress when mounted, is described Annex A.
Annex H provides some explanations concerning various types of mechanical stress when
mounted.
The test method specified in this standard is not intended to evaluate semiconductor devices
themselves.
NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result
of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be
used to guarantee the mounting reliability of the packages.
NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use
and handling after mounting.

Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen

Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matriciel

L'IEC 62137-4:2014 spécifie la méthode d'essai des joints brasés des boîtiers de type matriciel montés sur la carte de câblage imprimé, visant à évaluer la durabilité des joints brasés par rapport aux contraintes thermiques et mécaniques. La présente partie de l'IEC 62137 s'applique aux dispositifs à semiconducteurs pour montage en surface avec boîtiers de type matriciel (FBGA, BGA, FLGA et LGA) incluant les boîtiers de type à bornes périphériques (SON et QFN) qui sont destinés à être utilisés dans des matériels électriques ou électroniques industriels ou grand public. L'IEC 62137-4 inclut les modifications techniques majeures suivantes par rapport à l'IEC 62137:2004:
- les conditions d'essai pour l'utilisation d'une soudure sans plomb ont été incluses;
- les conditions d'essai pour des soudures sans plomb ont été ajoutées;
- les accélérations de l'essai de cycle de température pour des joints brasés ont été ajoutées.

Tehnologija elektronskega sestavljanja - 4. del: Metode za preskušanje vzdržljivosti kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini

Ta del standarda IEC 62137 določa metode za preskušanje kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini, ki so montirani na ploščo tiskanega vezja, za oceno vzdržljivosti kositrnih spojev pri toplotno-mehanskih obremenitvah. Ta del standarda IEC 62137 velja za polprevodniške elemente za površinsko montažo z okrovi z matričnimi priključki v ravnini (FBGA, BGA, FLGA in LGA), vključno s perifernimi priključki
(SON in QFN), ki so namenjeni uporabi v električni in elektronski industrijski in zabavni elektroniki.
Dejavnik pospešenega slabšanja kositrnih spojev priključkov pri preskusu kroženja temperature zaradi toplotne obremenitve pri montaži je opisan v dodatku A. Dodatek H ponuja nekaj razlag v povezavi z različnimi tipi mehanskih obremenitev pri montaži. Preskusna metoda, določena s tem standardom, ni namenjena oceni polprevodniških elementov.
OPOMBA 1 Pogoji pri montaži, materiali za spajkanje itd. pomembno vplivajo na rezultat preskusa, določenega s tem standardom. Zato preskus, opisan s tem standardom, ni mišljen kot preskus, ki je namenjen zagotavljanju zmožnosti montaže paketov.
OPOMBA 2 Ta preskusna metoda ni nujna, če kositrni spoji niso izpostavljeni obremenitvi (mehanski ali drugi) pri uporabi na terenu in obdelavi po montaži.

General Information

Status
Published
Publication Date
13-Aug-2015
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
11-Feb-2015
Due Date
18-Apr-2015
Completion Date
14-Aug-2015

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SLOVENSKI STANDARD
SIST EN 62137-4:2015
01-september-2015
1DGRPHãþD
SIST EN 62137:2005
7HKQRORJLMDHOHNWURQVNHJDVHVWDYOMDQMDGHO0HWRGH]DSUHVNXãDQMH
Y]GUåOMLYRVWLNRVLWUQLKVSRMHYHOHPHQWRY]DSRYUãLQVNRPRQWDåR]RNURYL]
PDWULþQLPLSULNOMXþNLYUDYQLQL
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area
array type package surface mount devices
Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare
Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen
Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais
d'endurance des joints brasés des composants pour montage en surface à boîtiers de
type matriciel
Ta slovenski standard je istoveten z: EN 62137-4:2014
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 62137-4:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62137-4:2015

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SIST EN 62137-4:2015


EUROPEAN STANDARD EN 62137-4

NORME EUROPÉENNE

EUROPÄISCHE NORM
December 2014
ICS 31.190

English Version
Electronics assembly technology -
Part 4: Endurance test methods for solder joint of area array type
package surface mount devices
(IEC 62137-4:2014)
Technique d'assemblage des composants électroniques - Montageverfahren für elektronische Baugruppen -
Partie 4: Méthodes d'essais d'endurance des joints brasés Teil 4: Oberflächenmontierbare Bauteilgehäuse mit
des composants pour montage en surface à boîtiers de Flächenmatrix - (Lebens-)Dauerprüfungen für
type matriciel Lötverbindungen
(CEI 62137-4:2014) (IEC 62137-4:2014)
This European Standard was approved by CENELEC on 2014-11-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62137-4:2014 E

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SIST EN 62137-4:2015
EN 62137-4:2014 - 2 -
Foreword
The text of document 91/1188/FDIS, future edition 1 of IEC 62137-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62137-4:2014.

The following dates are fixed:
(dop) 2015-08-13
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-11-13
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62137-4:2014 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1:1988+A1:1992 NOTE Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2.
IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6.
IEC 60068-2-21:2006 NOTE Harmonized as EN 60068-2-21:2006 (not modified).
IEC 60068-2-27 NOTE Harmonized as EN 60068-2-27.
IEC 60068-2-44:1995 NOTE Harmonized as EN 60068-2-44:1995 (not modified).
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
1)
IEC 60068-2-78:2001 NOTE Harmonized as EN 60068-2-78:2001 (not modified).
IEC 60749-1:2002 NOTE Harmonized as EN 60749-1:2003 (not modified).
IEC 60749-20:2008 NOTE Harmonized as EN 60749-20:2009 (not modified).
IEC 60749-20-1:2009 NOTE Harmonized as EN 60749-20-1:2009 (not modified).
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8.
IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified).
IEC 61189-5 NOTE Harmonized as EN 61189-5.
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified).
IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3.
IEC 62137-1-4:2009 NOTE Harmonized as EN 62137-1-4:2009 (not modified).


1)
Superseded by EN 60068-2-78:2013 (IEC 60068-2-78:2012): DOW = 2015-12-03.

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SIST EN 62137-4:2015
- 3 - EN 62137-4:2014
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

IEC 60068-2-14 -  Environmental testing - EN 60068-2-14 -
Part 2-14: Tests - Test N: Change of
temperature
IEC 60191-6-2 -  Mechanical standardization of EN 60191-6-2 -
semiconductor devices -
Part 6-2: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for 1,50 mm, 1,27 mm and 1,00 mm
pitch ball and column terminal packages
IEC 60191-6-5 -  Mechanical standardization of EN 60191-6-5 -
semiconductor devices -
Part 6-5: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for fine-pitch ball grid array (FBGA)
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61190-1-3 -  Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering
applications
IEC 61249-2-7 -  Materials for printed boards and other EN 61249-2-7 -
interconnecting structures -
Part 2-7: Reinforced base materials, clad
and unclad - Epoxide woven E-glass
laminated sheet of defined flammability
(vertical burning test), copper-clad
IEC 61249-2-8 -  Materials for printed boards and other EN 61249-2-8 -
interconnecting structures -
Part 2-8: Reinforced base materials, clad
and unclad - Modified brominated epoxide
woven fibreglass reinforced laminated
sheets of defined flammability (vertical
burning test), copper-clad

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SIST EN 62137-4:2015
EN 62137-4:2014 - 4 -
Publication Year Title EN/HD Year

IEC 62137-3 2011 Electronics assembly technology - EN 62137-3 2012
Part 3: Selection guidance of
environmental and endurance test
methods for solder joints

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SIST EN 62137-4:2015




IEC 62137-4

®


Edition 1.0 2014-10




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Electronics assembly technology –

Part 4: Endurance test methods for solder joint of area array type package

surface mount devices




Technique d'assemblage des composants électroniques –

Partie 4: Méthodes d'essais d'endurance des joints brasés des composants


pour montage en surface à boîtiers de type matriciel













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX X


ICS 31.190 ISBN 978-2-8322-1873-0



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 62137-4:2015
– 2 – IEC 62137-4:2014 © IEC 2014
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 9
4 General . 9
5 Test apparatus and materials . 10
5.1 Specimen . 10
5.2 Reflow soldering equipment . 10
5.3 Temperature cycling chamber . 10
5.4 Electrical resistance recorder . 10
5.5 Test substrate . 10
5.6 Solder paste . 11
6 Specimen preparation . 11
7 Temperature cycling test . 13
7.1 Pre-conditioning . 13
7.2 Initial measurement . 13
7.3 Test procedure . 13
7.4 End of test criteria. 15
7.5 Recovery . 15
7.6 Final measurement . 15
8 Temperature cycling life . 15
9 Items to be specified in the relevant product specification . 15
Annex A (informative) Acceleration of the temperature cycling test for solder joints . 17
A.1 General . 17
A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 17
A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 18
A.4 Factor that affects the temperature cycling life of the solder joint . 22
Annex B (informative) Electrical continuity test for solder joints of the package . 23
B.1 General . 23
B.2 Package and daisy chain circuit . 23
B.3 Mounting condition and materials . 23
B.4 Test method . 23
B.5 Temperature cycling test using the continuous electric resistance monitoring
system . 23
Annex C (informative) Reflow solderability test method for package and test substrate
land . 25
C.1 General . 25
C.2 Test equipment . 25
C.2.1 Test substrate. 25
C.2.2 Pre-conditioning oven . 25
C.2.3 Solder paste . 25
C.2.4 Metal mask for screen printing . 25
C.2.5 Screen printing equipment . 25

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SIST EN 62137-4:2015
IEC 62137-4:2014 © IEC 2014 – 3 –
C.2.6 Package mounting equipment . 25
C.2.7 Reflow soldering equipment . 25
C.2.8 X-ray inspection equipment . 26
C.3 Standard mounting process . 26
C.3.1 Initial measurement . 26
C.3.2 Pre-conditioning . 26
C.3.3 Package mounting on test substrate . 26
C.3.4 Recovery . 27
C.3.5 Final measurement . 27
C.4 Examples of faulty soldering of area array type packages . 27
C.4.1 Repelled solder by contamination on the ball surface of the BGA
package . 27
C.4.2 Defective solder ball wetting caused by a crack in the package . 27
C.5 Items to be given in the product specification . 28
Annex D (informative) Test substrate design guideline . 29
D.1 General . 29
D.2 Design standard . 29
D.2.1 General . 29
D.2.2 Classification of substrate specifications . 29
D.2.3 Material of the test substrate . 31
D.2.4 Configuration of layers of the test substrate . 31
D.2.5 Land shape of test substrate . 31
D.2.6 Land dimensions of the test substrate . 31
D.3 Items to be given in the product specification . 32
Annex E (informative) Heat resistance to reflow soldering for test substrate . 33
E.1 General . 33
E.2 Test apparatus . 33
E.2.1 Pre-conditioning oven . 33
E.2.2 Reflow soldering equipment . 33
E.3 Test procedure . 33
E.3.1 General . 33
E.3.2 Pre-conditioning . 33
E.3.3 Initial measurement . 33
E.3.4 Moistening process (1) . 34
E.3.5 Reflow heating (1) . 34
E.3.6 Moistening process (2) . 34
E.3.7 Reflow heating process (2) . 34
E.3.8 Final measurement . 34
E.4 Items to be given in the product specification . 34
Annex F (informative) Pull strength measurement method for the test substrate land . 35
F.1 General . 35
F.2 Test apparatus and materials . 35
F.2.1 Pull strength measuring equipment . 35
F.2.2 Reflow soldering equipment . 35
F.2.3 Test substrate. 35
F.2.4 Solder ball . 35
F.2.5 Solder paste . 35
F.2.6 Flux . 35
F.3 Measurement procedure . 36

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SIST EN 62137-4:2015
– 4 – IEC 62137-4:2014 © IEC 2014
F.3.1 Pre-conditioning . 36
F.3.2 Solder paste printing . 36
F.3.3 Solder ball placement . 36
F.3.4 Reflow heating process . 36
F.3.5 Pull strength measurement . 36
F.3.6 Final measurement . 37
F.4 Items to be given in the product specification . 37
Annex G (informative) Standard mounting process for the packages . 38
G.1 General . 38
G.2 Test apparatus and materials . 38
G.2.1 Test substrate. 38
G.2.2 Solder paste . 38
G.2.3 Metal mask for screen printing . 38
G.2.4 Screen printing equipment . 38
G.2.5 Package mounting equipment . 38
G.2.6 Reflow soldering equipment . 38
G.3 Standard mounting process . 39
G.3.1 Initial measurement . 39
G.3.2 Solder paste printing . 39
G.3.3 Package mounting . 39
G.3.4 Reflow heating process . 39
G.3.5 Recovery . 40
G.3.6 Final measurement . 40
G.4 Items to be given in the product specification . 40
Annex H (informative) Mechanical stresses to the packages . 41
H.1 General . 41
H.2 Mechanical stresses . 41
Bibliography . 42

Figure 1 – Region for evaluation of the endurance test . 10
Figure 2 – Typical reflow soldering profile for Sn63Pb37 solder alloy . 12
Figure 3 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy . 13
Figure 4 – Test conditions of temperature cycling test. 14
Figure A.1 – FBGA package device and FEA model for calculation of acceleration
factors AF . 20
Figure A.2 – Example of acceleration factors AF with an FBGA package device using
Sn96,5Ag3Cu,5 solder alloy . 21
Figure A.3 – Fatigue characteristics of Sn96,5Ag3Cu,5 an alloy micro solder joint
(N = 20 % load drop from initial load) . 22
f
Figure B.1 – Example of a test circuit for the electrical continuity test of a solder joint . 23
Figure B.2 – Measurement example of continuously monitored resistance in the

temperature cycling test . 24
Figure C.1 – Temperature measurement of specimen using thermocouples . 26
Figure C.2 – Repelled solder caused by contamination on the solder ball surface . 27
Figure C.3 – Defective soldering as a result of a solder ball drop . 28
Figure D.1 – Standard land shapes of the test substrate . 31
Figure F.1 – Measuring methods for pull strength . 36

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SIST EN 62137-4:2015
IEC 62137-4:2014 © IEC 2014 – 5 –
Figure G.1 – Example of printed conditions of solder paste . 39
Figure G.2 – Temperature measurement of the specimen using thermocouples . 40

Table 1 – Test conditions of temperature cycling test . 14
Table A.1 – Example of test results of the acceleration factor (Sn63Pb37 solder alloy) . 18
Table A.2 – Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder
alloy) . 20
Table A.3 – Material constant and inelastic strain range calculated by FEA for FBGA
package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) . 21
Table D.1 – Types classification of the test substrate . 30
Table D.2 – Standard layers' configuration of test substrates . 31
Table G.1 – Stencil design standard for packages . 38
Table H.1 – Mechanical stresses to mounted area array type packages . 41

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SIST EN 62137-4:2015
– 6 – IEC 62137-4:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

ELECTRONICS ASSEMBLY TECHNOLOGY –

Part 4: Endurance test methods for solder joint
of area array type package surface mount devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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in the subject dealt with may participate in this preparatory work. International, governmental and non-
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consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Pub
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