iTeh StandardsiTeh Standards
EURUSD
Your shopping cart is empty.
SIST

SIST EN 190110:2002

(Main)

Blank Detail Specification: Digital microprocessor integrated circuits

Blank Detail Specification: Digital microprocessor integrated circuits

This BDS relates to:
- digital microprocessors, generally in accordance with IEC 747 and IEC 748 : Semiconductor devices - Discrete devices and integrated circuits
- digital integrated circuits which are primarily designed or intended for use with microprocessors.
Analogue and interface aspects of such devices shall be added to the Detail Specification in accordance with CECC 90 200 and CECC 90 300.

Vordruck für Bauartspezifikation: Integrierte Mikroprozessor-Schaltungen

Spécification particulière cadre: Microprocesseurs logiques à circuits intégrés

Blank detail specification: Digital microprocessor integrated circuits

General Information

Status
Published
Publication Date
31-Aug-2002
ICS
31.200 - Integrated circuits. Microelectronics
Technical Committee
SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Sep-2002
Due Date
01-Sep-2002
Completion Date
01-Sep-2002
Ref Project
EN 190110:1994 - Blank Detail Specification: Digital microprocessor integrated circuits

Buy Standard

EN 190110:2002EN 190110:2002
PreviousNext
Standard
EN 190110:2002
English language
16 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Blank detail specification: Digital microprocessor integrated circuitsVordruck für Bauartspezifikation: Integrierte Mikroprozessor-SchaltungenSpécification particulière cadre: Microprocesseurs logiques à circuits intégrésBlank Detail Specification: Digital microprocessor integrated circuits31.200Integrirana vezja, mikroelektronikaIntegrated circuits. MicroelectronicsICS:Ta slovenski stand
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

This May Also Interest You

SIST
SIST EN 62258-5:2007(Main)
Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation
EN 62258-5:2006

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

  • Standard
    15 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 62258-6:2007(Main)
Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation
EN 62258-6:2006

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

  • Standard
    12 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 62132-4:2006(Main)
Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz -- Part 4: Direct RF power injection method
EN 62132-4:2006

This part of IEC 62132 describes a method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method guarantees a high degree of repeatability and correlation of immunity measurements. This standard establishes a common base for the evaluation of semiconductor devices used in equipment functioning in an environment subject to unwanted radio frequency electromagnetic waves.

  • Standard
    28 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 62132-5:2006(Main)
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz -- Part 5: Workbench Faraday cage method
EN 62132-5:2006

This measurement procedure describes a measurement  method to quantify the RF immunity of integrated circuits (ICs)  mounted on a standardized test board or on their final  application board (PCB), to electromagnetic conductive  disturbances.

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 190109:2006(Main)
Family Specification: Digital integrated HC MOS circuits - Series HC/HCT/HCU
EN 190109:1994

The document contains the family specification: Digital  Integrated HC MOS Circuits; Series HC/HCT/HCU. Describes  limiting conditions of use the family, recomending operating  conditions and associated characteristics for the family, test  methods and procedures and inspection requirements.

  • Standard
    48 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 165000-1:2006(Main)
Film and hybrid integrated circuits -- Part 1: Generic specification - Capability approval procedure
EN 165000-1:1996

This specification prescribes the quality assessment  procedures and methods of tests to be used in the  assessment of film and hybrid integrated circuits intended for  use in electronic equipment, under the capability approval  procedure. It also applies to part completed devices supplied  to customers for subsequent processing. It should be read in  conjunction with EN 165000-2, -3 and -4.

  • Standard
    62 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 60747-16-10:2005(Main)
Semiconductor devices -- Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
EN 60747-16-10:2004

Specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality.

  • Standard
    59 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 60747-16-4:2005(Main)
Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches
EN 60747-16-4:2004

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.

  • Standard
    31 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 60747-5-3:2002/A1:2004(Amendment)
Discrete semiconductor devices and integrated circuits -- Part 5-3: Optoelectronic devices - Measuring methods
EN 60747-5-3:2001/A1:2002

EN following parallel vote

  • Amendment
    15 pages
    English language
    sale 10% off
    e-Library read for
    1 day
SIST
SIST EN 60747-16-3:2004(Main)
Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters
EN 60747-16-3:2002

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
converters.

  • Standard
    43 pages
    English language
    sale 10% off
    e-Library read for
    1 day