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EUROPEAN STANDARD
EN 62047-2

NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices
Part 2: Tensile testing method of thin film materials
(IEC 62047-2:2006)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques Bauteile der Mikrosystemtechnik
Partie 2: Méthode d'essai de traction Teil 2: Prüfverfahren zur
des matériaux en couche mince Zugbeanspruchung bei
(CEI 62047-2:2006) Dünnschicht-Werkstoffen
(IEC 62047-2:2006)




This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-2:2006 E

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EN 62047-2:2006 - 2 -
Foreword
The text of document 47/1865/FDIS, future edition 1 of IEC 62047-2, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62047-2 on 2006-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-2:2006 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 62047-2:2006

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1)
ISO 6892 - Metallic materials - Tensile testing at ambient - -
temperature




1)
Undated reference.

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NORME CEI
INTERNATIONALE
IEC



62047-2
INTERNATIONAL


Première édition
STANDARD

First edition

2006-08


Dispositifs à semiconducteurs –
Dispositifs microélectromécaniques –
Partie 2:
Méthode d'essai de traction
des matériaux en couche mince

Semiconductor devices –
Micro-electromechanical devices –
Part 2:
Tensile testing method of thin film materials

 IEC 2006 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
M
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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62047-2  IEC:2006 – 3 –
CONTENTS
FOREWORD.5

1 Scope.9
2 Normative references .9
3 Symbols and designations .9
4 Testing method and test apparatus.11
4.1 Method of gripping .11
4.2 Method of loading.11
4.3 Speed of testing .11
4.4 Force measurement .11
4.5 Elongation measurement.11
4.6 Stress-strain curve .13
4.7 Environment control .13
5 Test piece .13
5.1 General .13
5.2 Plane shape of test piece .13
5.3 Test piece thickness.15
5.4 Gauge mark .15
6 Test report.15

Annex A (informative) Test piece grip methods .17
Annex B (normative) Testing conditions .21
Annex C (informative) Test piece .23

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62047-2  IEC:2006 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 2: Tensile testing method of thin film materials


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-2 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1865/FDIS 47/1878/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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62047-2  IEC:2006 – 7 –
A list of all parts of the IEC 62047 series, under the general title Semiconductor devices –
Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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62047-2  IEC:2006 – 9 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 2: Tensile testing method of thin film materials



1 Scope
This International Standard specifies the method for tensile testing of thin film materials with
length and width under 1 mm and thickness under 10 µm, which are main structural materials
for micro-electromechanical systems (MEMS), micromachines and similar devices.
The main structural materials for MEMS, micromachines and similar devices have special
features such as typical dimensions in the order of a few microns, a material fabrication by
deposition, and a test piece fabrication by non-mechanical machining using etching and
photolithography. This International Standard specifies the testing method, which enables a
guarantee of accuracy corresponding to the special features.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
ISO 6892, Metallic materials – Tensile testing at ambient temperature
3 Symbols and designations
Symbols and corresponding designations are given in Table 1.
Table 1 – Symbols and designations of a test piece
Symbol Unit Designation
a µm Thickness of a test piece
b µm Width of the parallel length of a test piece
L µm Original gauge length
o
L µm Parallel length
c
L µm Total length of test piece
t
2
S µm Original cross-sectional area of the parallel length
o
R
µm Radius of curvature of the transition curves between the
gripped ends and the parallel length

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62047-2  IEC:2006 – 11 –

Gauge mark Grip ends
a
S
0
R
L
0
L
c
L
t
IEC  1424/06

Figure 1 – Thin film test piece
4 Testing method and test apparatus
4.1 Method of gripping
The test piece should be gripped to the test apparatus to prevent unwanted stress such as
bending and shear stress during the test.
The grip should have the following two properties:
a) fixing force is uniformly applied on the gripped end of the test piece;
b) the grips are aligned to the tensile axis of the test apparatus.
The test apparatus should have a test piece alignment mechanism to align the test piece
tensile axis to the moving direction of the test apparatus. See Annex A.
4.2 Method of loading
The tensile force should be applied along the tensile axis of the test piece to avoid the
bending stress to the test piece. The tensile axis and the moving direction should be aligned.
The following two conditions should be satisfied to prevent the generation of the bending
stress:
a) linearity of movement in the test apparatus,
b) alignment between the tensile axis of the test piece and the moving axis of the test
apparatus.
4.3 Speed of testing
The straining rate should be lower than 0,01 /s. The straining rate or the stress rate should be
constant during the test. See Clause B.1.
4.4 Force measurement
A load cell with enough resolution, which guarantees 5 % accuracy of the measured tensile
strength, shall be used for the force measurement. See Clause B.2.
4.5 Elongation measurement
The measurement method that enables to measure 0,1 % strain value shall be used.

b

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