SIST EN 61967-8:2012

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.XIntegrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-StreifenleiterverfahrenCircuits intégrés - Mesure des émissions électromagnétiques -- Partie 8: Mesure des émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CIIntegrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 8: Measurement of radiated emissions - IC stripline method31.200Integrirana vezja, mikroelektronikaIntegrated circuits. MicroelectronicsICS:Ta slovenski standard je istoveten z:EN 61967-8:2011SIST EN 61967-8:2012en,fr,de01-januar-2012SIST EN 61967-8:2012SLOVENSKI
STANDARD



SIST EN 61967-8:2012



EUROPEAN STANDARD EN 61967-8 NORME EUROPÉENNE
EUROPÄISCHE NORM October 2011
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61967-8:2011 E
ICS 31.200
English version
Integrated circuits -
Measurement of electromagnetic emissions -
Part 8: Measurement of radiated emissions -
IC stripline method (IEC 61967-8:2011)
Circuits intégrés -
Mesure des émissions électromagnétiques -
Partie 8: Mesure des émissions rayonnées -
Méthode de la ligne TEM à plaques (stripline) pour CI (CEI 61967-8:2011)
Integrierte Schaltungen -
Messung von elektromagnetischen Aussendungen -
Teil 8: Messung der abgestrahlten Aussendungen -
IC-Streifenleiterverfahren (IEC 61967-8:2011)
This European Standard was approved by CENELEC on 2011-09-15. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 61967-8:2012



EN 61967-8:2011 - 2 -
Foreword The text of document 47A/868/FDIS, future edition 1 of IEC 61967-8, prepared by SC 47A, "Integrated circuits", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61967-8:2011.
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-06-15 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2014-09-15
This standard is to be used in conjunction with EN 61967-1. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 61967-8:2011 was approved by CENELEC as a European Standard without any modification. SIST EN 61967-8:2012



- 3 - EN 61967-8:2011
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050-131 - International Electrotechnical Vocabulary (IEV) -
Part 131: Circuit theory - -
IEC 60050-161 - International Electrotechnical Vocabulary (IEV) -
Chapter 161: Electromagnetic compatibility - -
IEC 61000-4-20 - Electromagnetic compatibility (EMC) -
Part 4-20: Testing and measurement techniques - Emission and immunity testing in transverse electromagnetic (TEM) waveguides EN 61000-4-20 -
IEC 61967-1 - Integrated circuits - Measurement of electromagnetic emissions,
150 kHz to 1 GHz -
Part 1: General conditions and definitions EN 61967-1 -
IEC 61967-2 - Integrated circuits - Measurement of electromagnetic emissions,
150 kHz to 1 GHz -
Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method EN 61967-2 -
SIST EN 61967-8:2012



SIST EN 61967-8:2012



IEC 61967-8 Edition 1.0 2011-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Integrated circuits – Measurement of electromagnetic emissions –
Part 8: Measurement of radiated emissions – IC stripline method
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques (stripline) pour CI
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE Q ICS 31.200 PRICE CODE CODE PRIX ISBN 978-2-88912-619-4
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale ®
SIST EN 61967-8:2012 colourinside



– 2 – 61967-8 © IEC:2011 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 General . 6 5 Test conditions . 6 5.1 General . 6 5.2 Supply voltage. 6 5.3 Frequency range . 6 6 Test equipment . 7 6.1 General . 7 6.2 RF measuring instrument . 7 6.3 Preamplifier . 7 6.4 IC stripline . 7 6.5 50 Ω termination . 7 6.6 System gain . 7 7 Test set-up . 8 7.1 General . 8 7.2 Test configuration . 8 7.3 EMC test board (PCB) . 8 8 Test procedure . 9 8.1 General . 9 8.2 Ambient conditions . 9 8.3 Operational check . 9 8.4 Verification of IC stripline RF characteristic . 9 8.5 Test technique. 9 9 Test report. 10 9.1 General . 10 9.2 Measurement conditions . 10 10 IC Emissions reference levels. 10 Annex A (normative)
IC stripline description. 11 Annex B (informative)
Specification of emission levels . 15 Bibliography . 17
Figure 1 – IC stripline test set-up . 8 Figure A.1 – Cross section view of an example of an unshielded IC stripline . 11 Figure A.2 – Cross section view of an example of an IC stripline with housing . 12 Figure A.3 – Example of IC stripline with housing . 14 Figure B.1 – Emission characterization levels . 16
Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version . 12 Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version . 12
SIST EN 61967-8:2012



61967-8 © IEC:2011 – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –
Part 8: Measurement of radiated emissions –
IC stripline method
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61967-8 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47A/868/FDIS 47A/870/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. SIST EN 61967-8:2012



– 4 – 61967-8 © IEC:2011 This part of IEC 61967 is to be read in conjunction with IEC 61967-1. A list of all parts of IEC 6xxxx series, under the general title Integrated circuits – Measurement of electromagnetic emissions can be found on the IEC website.
NOTE Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the next edition. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer.
SIST EN 61967-8:2012



61967-8 © IEC:2011 – 5 – INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –
Part 8: Measurement of radiated emissions –
IC stripline method
1 Scope The measurement procedure of this part of IEC 61967 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement.
2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050-131: International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory IEC 60050-161: International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-magnetic compatibility IEC 61967-1: Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 1: General conditions and definitions IEC 61967-2: Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell method IEC 61000-4-20: Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 61967-1, IEC 60050-131 and IEC 60050-161 as well as the following apply. 3.1
transverse electromagnetic (TEM) mode waveguide mode in which the components of the electric and magnetic fields in the propagation direction are much less than the primary field components across any transverse cross-section 3.2
TEM waveguide open or closed transmission line system, in which a wave is propagating in the transverse electromagnetic mode to produce a specified field for testing purposes SIST EN 61967-8:2012



– 6 – 61967-8 © IEC:2011 3.3
IC stripline TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged ground plane, connected to a port structure on each end and an optional shielded enclosure NOTE This arrangement guides a wave propagation in the transverse electromagnetic mode to produce a specific field for testing purposes between the active conductor and the enlarged ground plane. As enlarged ground plane the ground plane of the standard EMC test board according to IEC 61967-1 should be used. An optional shielding enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed version of the IC stripline in opposite to the open version without shie
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