Electronics assembly technology - Electronic modules

This International Standard provides a generic standard of electronic modules on which their sectional standards are based. This standard provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.

Montageverfahren für elektronische Baugruppen - Elektronikmodule

Techniques d'assemblage des composants électroniques - Modules électroniques

L'IEC 62421:2007 consiste en une norme générique relative aux modules électroniques sur laquelle sont fondées les normes intermédiaires associées. Il fournit une définition, un modèle commercial, une interface entre les partenaires commerciaux, et les domaines concernés par la normalisation des modules électroniques. De plus une série de méthode d'essai générique est fournie.

Tehnologija elektronskega sestavljanja - Elektronski moduli (IEC 62421:2007)

General Information

Status
Published
Publication Date
12-Dec-2007
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
27-Nov-2007
Due Date
01-Feb-2008
Completion Date
13-Dec-2007

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SLOVENSKI STANDARD
SIST EN 62421:2008
01-februar-2008
Tehnologija elektronskega sestavljanja - Elektronski moduli (IEC 62421:2007)
Electronics assembly technology - Electronic modules
Montageverfahren für elektronische Baugruppen - Elektronikmodule
Techniques d'assemblage des composants électroniques - Modules électroniques
Ta slovenski standard je istoveten z: EN 62421:2007
ICS:
31.190
SIST EN 62421:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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EUROPEAN STANDARD
EN 62421

NORME EUROPÉENNE
October 2007
EUROPÄISCHE NORM

ICS 31.190


English version


Electronics assembly technology -
Electronic modules
(IEC 62421:2007)


Techniques d'assemblage  Montageverfahren
des composants électroniques - für elektronische Baugruppen -
Modules électroniques Elektronikmodule
(CEI 62421:2007) (IEC 62421:2007)




This European Standard was approved by CENELEC on 2007-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62421:2007 E

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EN 62421:2007 - 2 -
Foreword
The text of document 91/689/FDIS, future edition 1 of IEC 62421, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 62421 on 2007-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62421:2007 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 62421:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year


IEC 60068 Series Environmental testing EN 60068-1 Series


1)
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
Part 1: General and guidance


2) 3)
IEC 60068-2-1 - Environmental testing - EN 60068-2-1 2007
Part 2-1: Tests - Test A: Cold


2) 3)
IEC 60068-2-2 - Environmental testing - EN 60068-2-2 2007
Part 2-2: Tests - Test B: Dry heat


2) 3)
IEC 60068-2-6 - Environmental testing - EN 60068-2-6 1995
Part 2-6: Tests - Test Fc: Vibration
(sinusoidal)


2) 3)
IEC 60068-2-14 - Environmental testing - EN 60068-2-14 1999
Part 2-14: Tests - Test N: Change of
temperature


2) 3)
IEC 60068-2-20 - Environmental testing - HD 323.2.20 S3 1988
Part 2-20: Tests - Test T: Soldering


2) 3)
IEC 60068-2-21 - Environmental testing - EN 60068-2-21 2006
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices


2) 3)
IEC 60068-2-27 - Environmental testing - EN 60068-2-27 1993
Part 2-27: Tests - Test Ea and guidance:
Shock


2) 3)
IEC 60068-2-45 - Environmental testing - EN 60068-2-45 1992
Part 2-45: Tests - Test Xa and guidance:
Immersion in cleaning solvents


2) 3)
IEC 60068-2-58 - Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)


2) 3)
IEC 60068-2-78 - Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state



1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated refetence.
3)
Valid edition at date of issue.

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EN 62421:2007 - 4 -
Publication Year Title EN/HD Year
2)
ISO 3 - Preferred numbers - Series of preferred - -
numbers

---------------------- Page: 5 ----------------------

IEC 62421
Edition 1.0 2007-08
INTERNATIONAL
STANDARD

Electronics assembly technology – Electronic modules


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
P
ICS 31.190 ISBN 2-8318-9300-3

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– 2 – 62421 © IEC:2007(E)
CONTENTS
FOREWORD.4

1 Scope and object.6
2 Normative references .6
3 Terms and definitions .7
4 Business model and interface between supplier and user .7
4.1 Business model (see Figure 1 and Figure 2).7
4.1.1 General .7
4.1.2 E-type business model .8
4.1.3 M-type business model.9
4.1.4 F-type business model.9
4.2 S-U interface (see Figure 1) .9
4.2.1 S-U interface –1 .9
4.2.2 S-U interface–2 .9
4.2.3 S-U interface–3 .9
4.3 Standardization areas .9
5 Preferred ratings .10
5.1 General .10
5.2 Preferred operating temperature range.11
5.3 Preferred rated voltage.11
6 Tests and measuring methods .11
6.1 Standard atmospheric conditions.11
6.1.1 Standard atmospheric conditions for testing .11
6.1.2 Referee conditions .11
6.1.3 Reference conditions.12
6.2 Electrical performance tests .12
6.2.1 General .12
6.2.2 Protection of electronic modules and test equipment .12
6.2.3 Accuracy of measurement .12
6.3 Mechanical performance tests .13
6.3.1 Robustness of terminations and integral mounting devices .13
6.3.2 Resistance to soldering heat .14
6.3.3 Solderability .14
6.3.4 Shock .14
6.3.5 Vibration (sinusoidal).14
6.3.6 Resistance to solvents.15
6.4 Climatic performance tests .15
6.4.1 Dry heat .15
6.4.2 Cold .15
6.4.3 Damp heat, steady state.16
6.4.4 Change of temperature.16

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62421 © IEC:2007(E) – 3 –
Figure 1 – S-U interfaces in each business model.8
Figure 2 – Standardization areas in M-type and F-type business models .10

Table 1 – Preferred temperatures to be selected for temperature ranges (°C).11
Table 2 – Referee conditions .12
Table 3 – Application .14

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– 4 – 62421 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________

ELECTRONICS ASSEMBLY TECHNOLOGY –
ELECTRONIC MODULES


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62421 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/689/FDIS 91/722/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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62421 © IEC:2007(E) – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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– 6 – 62421 © IEC:2007(E)
ELECTRONICS ASSEMBLY TECHNOLOGY –
ELECTRONIC MODULES



1 Scope and object
This International Standard provides a generic standard of electronic modules on which their
sectional standards are based.
This standard provides a definition, business model, interface between the trading partners,
and related areas of standardization of electronic modules. In addition a generic set of test
method is provided.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068 (all parts), Environmental testing
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-1: Environmental Testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2: Environmental testing – Part 2-2: Tests – Tests B: Dry heat
IEC 60068-2-6: Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14: Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-20: Environmental testing – Part 2-20: Tests – Test T: Soldering
IEC 60068-2-21: Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27: Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-45: Environmental testing – Part 2-45: Tests – Test XA and guidance: Immersion
in cleaning solvents
IEC 60068-2-58: Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-78: Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
ISO 3: Preferred numbers – Series of preferred numbers

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62421 © IEC:2007(E) – 7 –
3 Terms and definitions
For the purposes of this document, the terms and definitions given in the IEC 60068 series, as
well as the following, apply.
3.1
electronic module
functional block which contains individual electronic elements and /or electronic packages, to
be used in a next level assembly
NOTE An individual module having an application-specific function, including electronic, optoelectronic,
mechanical or other elements. The module typically provides protection of its elements and packages to assure the
required level of reliability.
Electronic modules may be categorized by signal interface, for example:
– wired module: a module which has only electrical interfaces (majority of present day modules)
– wireless module: a module which has a wireless interface
– opto-electronic module: a module which has an optoelectronic interface
– sensor module: a module which can input physical information
– actuator module: a module which could output physical information
3.2
coplanarity
distance in height between the lowest and highest leads or terminals when the module is in its
seating plane
3.3
operating temperature range
range of the ambient temperature at which an electronic module may be used continuously
3.4
storage
...

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